The Boeing Company

Sutton Scoltock Jr

Shih-Chang Wu

Yaozhong Liu

Richard Fanucchi

Paul G Rosadiuk

Herbert Suyematsu

A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.

Growing community of inventors

Aliso Viejo, CA, United States of America

Sutton Scoltock Jr