Hitachi, Ltd.

Susumu Tsuzuku

Eisuke Nishitani

Hitoshi Yokono

Yasuo Hira

Shigeru Kobayashi

Masao Gotoh

Hideaki Shimamura

Akira Okamoto

Yuji Yoneoka

Satosi Kisimoto

Tsuyoshi Tamaru

Masashi Yamamoto

Osamu Kasahara

Masakazu Ishino

Sunao Matsubara

Hiroki Nezu

Yoshihisa Hosoe

Hiroyuki Shida

Yukio Tanigaki

Tokio Kato

Aizo Kaneda

Junichi Saeki

Mitsuo Nakatani

Mitsuaki Horiuchi

Reishi Naka

Makoto Iida

Masaaki Maehara

Koichiro Mizukami

Hiroshi Kaneko

Masayoshi Aoki

Kazumi Iijima

Yoshikazu Kimura

A vacuum processing apparatus for performing various processes on a wafer in a vacuum chamber, and a film deposition method and a film deposition apparatus using this vacuum processing apparatus. The vacuum processing apparatus, the film deposition method and the film deposition apparatus using the vacuum processing apparatus according to this invention are characterized in that temperature control of the wafer is performed in a film deposition process, and particularly characterized in that after the emissivity calibration using a combination of a temperature calibration stage and a shutter is performed, the substrate is transferred to stages in a vacuum film deposition process chamber, and a film is deposited on the substrate by controlling the substrate temperature to a specified temperature.

Vacuum processing apparatus, and a film deposition apparatus and a film deposition method both using the vacuum processing apparatus

The present invention relates to vacuum processing equipment for processing a wafer in a vacuum, and film coating or forming equipment and method for forming a film on a wafer wherein radiation measurement and temperature control of the wafer is carried out by using an infrared radiation thermometer. Based upon the radiation measurement, heating and/or cooling of the wafer during processing is carried out.

Vacuum processing device and film forming device and method using same

Vacuum processing equipment, film coating equipment and deposition method

The present invention relates to a method for filling small via holes provided to insulating film on a wafer to expose parts of the underlayer of the wafer by metal by means of CVD, and an apparatus therefor. The gist of the present invention lies in that, before CVD is conducted, a surface cleaning treatment of small via hole bottom underlayer surface and a stabilization treatment of insulating film surface activated thereby are carried out successively or simultaneously and optionally an anti-corrosive treatment is applied to underlayer surface, and then the CVD treatment is conducted without exposing the underlayer metal subjected to above treatments to the air. The present invention provides an effect of enabling via filling by metal which shows good selectivity and gives a low interfacial resistance between underlayer metal and filled metal.

Process for forming multilayer wiring

A metal thin film is deposited on predetermined portions of an underlayer of a substrate by a chemical deposition method with good selectivity, good reproducibility and high deposition rate by preventing hydrogen atoms from the adhesion to portions of the substrate not to be deposited with a metal using a special means for heating only the substrate or a special gas flow controlling means.

Method for selective deposition of metal thin film

A screen for projection television set comprising a foamed support and a reflective film adhered to the concave side of the support, said support having the outer layers with a high density such as 0.7 to 1.2 g/cm.sup.3 and the inner portion with a low density so as to make the density of the foamed support as a whole 0.2 to 0.5 g/cm.sup.3, has good projection properties, surface hardness with sufficiently strong support. When said support is foam molded by using a polyurethane having special polyol components, its heat resistance is remarkably increased and can be foam molded at high temperatures without deformation.

Screen for projection television

In a composition for producing polyurethane foam which comprises an organic polyisocynate compound, a compound having at least one active hydrogen atom in the molecule, a foaming agent and a catalyst as essential components, an aminoalkylsilane represented by the following general formula is contained: ##STR1## wherein n is 1 or 2, and R.sub.1 to R.sub.5 are alkyl groups. By use of such a catalyst polyurethane foam having a even color distribution and excellent mechanical properties is produced.

Catalyst and composition for producing polyurethane foam

Integral skin polymethane foams can be produced in a short time by impingement mixing a solution comprising polyols containing as an essential component a polyol derived from aromatic amine, a blowing agent and a special catalyst of tertiary amine salt having a hetero ring in the molecule, with a solution comprising one or more polyisocyanates, followed by injection into a closed mold and foaming and curing therein.

Process for producing integral skin polyurethane foam

A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.

Transfer molding method and transfer molding machine

A composition for polyurethane foam comprising (a) polyols containing at least one of alkylene oxide adducts of aniline-formaldehyde condensates and alkylene oxide adducts of reduced compounds of nitrated toluenes in an amount of 30 to 70% by weight of the polyols, (b) at least one isocyanate of the formula: ##STR1## a fire retardant, together with one or more conventional catalysts, foam stabilizers, blowing agents and the like additives, can give fire retardant, high impact and heat resistant urethane foams.

Composition for fire retardant urethane foam

Rigid polyurethane foams having excellent heat resistance and impact resistance can be produced with good workability due to good flow properties by using a composition comprising a polyol, a polyisocyanate, a blowing agent and a reaction accelerator as essential component, characterized by using as the polyol, a mixture of (a) an alkylene oxide adduct of 4,4'-diaminodiphenylmethane having OH value of 280-600 mg KOH/g, (b) an aliphatic polyether having a hdyroxyl value of 450-800 mg KOH/g and 3 or 4 hydroxyl groups in the molecule, and (c) a polyether having a hydroxyl value of 30 to 100 mg KOH/g and 2 or 3 hydroxyl groups in the molecule, in limited amounts.

Process for producing rigid polyurethane foam

Growing community of inventors

Tokyo, Japan

Susumu Tsuzuku