Japan Atomic Energy Research Institute

Jx Nippon Mining Metals Corporation

Hitachi, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Fuji Electric Co., Ltd.

Nippon Steel Corporation

The Furukawa Electric Co., Ltd.

Hitachi Cable, Inc.

Sumitomo Elec. Inc. Ltd.

Susumu Shimamoto

Toshinari Ando

Masataka Nishi

Yoshikazu Takahashi

Hiroshi Tsuji

Yuichiro Shindo

Atsushi Fukushima

Eisuke Tada

Takuya Suzuki

Katsuzo Aihara

Naofumi Tada

Hisanao Ogata

Yasuhiro Nakagawa

Kimio Kakizaki

Takashi Sato

Yoshio Furuto

Hiromichi Yoshida

Takashi Suzumura

Shinichiro Meguro

Takashi Zaizen

Hideo Nakajima

Ryozo Yamagishi

Takashi Kato

Ikuo Ito

Yasuhide Hattutori

Toshinari Andoh

Akira Ishihara

Yoshihiko Shindoh

Ikuo Itoh

Isamu Yamauchi

Setsu Sakamoto

Katsumi Suzuki

Tadao Hiyama

High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 &#x3bc;m or more and 20 &#x3bc;m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, O-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.

High purity copper and method of producing high purity copper based on electrolysis

Provided is a high-purity copper or high-purity copper alloy sputtering target of which the purity is 6N or higher and in which the content of the respective components of P, S, O and C is 1 ppm or less, wherein the number of nonmetal inclusions having a particle size of 0.5 &#x3bc;m or more and 20 &#x3bc;m or less is 30,000 inclusions/g or less. As a result of using high-purity copper or high-purity copper alloy from which harmful inclusions of P, S, C and O system have been reduced as the raw material and controlling the existence form of nonmetal inclusions, the present invention addresses a reduction in the percent defect of wirings of semiconductor device formed by sputtering a high-purity copper target so as to ensure favorable repeatability.

High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film

A stabilized superconducting wire comprises a multicore section having a number of filaments of superconducting compound material disposed in an alloy matrix, a stabilizing material section positioned around the multicore section, and a diffusion barrier layer disposed between the stabilizing material section and the multicore section and formed of an Fe-Cr alloy containing not less than 5 weight percent but not more than 25 weight percent Cr.

Stabilized superconducting wire

There is provided a forced-cooled superconductor including a conduit and a plurality of superconducting strands disposed within the conduit in spaced relationship. A coolant passes through the spaces between the strands for cooling the conduit and strands. The conduit and strands are further cooled by means of an additional separate cooling channel which cooperates with the coolant for cooling the conduit and strands.

Forced-cooled superconductor

Disclosed is a structural austenitic stainless steel with superior proof stress and toughness at cryogenic temperatures. The steel has a composition essentially consisting of, by weight, not greater than 0.05% of carbon, 0.20 to 0.70% of nitrogen, not greater than 1.0% of silicon, not greater than 25% of manganese, 13 to 35% of chromium, 5 to 25% of nickel and the balance substantially iron. The chromium content and manganese content is selected to meet the condition of (Cr+0.9 Mn).gtoreq.20%. The index of cleanliness showing the amount of nonmetallic inclusions is not greater than 0.1%.

Structural austenitic stainless steel with superior proof stress and

An aluminum-stabilized superconducting wire comprises an aluminum member, a copper member, and a first diffusion barrier layer formed between the aluminum member and the copper member. The copper member contains a plurality of bundles each having a multiplicity of fine filaments of Nb.sub.3 Sn embedded in a copper alloy and a second diffusion barrier layer surrounding the copper alloy. Preferably, the ratio m in the cross-sectional areas between the first diffusion barrier layer and the aluminum member is selected to meet the condition of 0.03.ltoreq.m&lt;3. The aluminum member is disposed at the central portion of the superconducting wire.

Aluminum-stabilized superconducting wire

A large number of fine electrical conductor wires (5, 6) are densely packed in a tube (1). The electric conductor wires (5, 6) occupy 50% to 85% of the cross-sectional area of the inside of the tube (1) and are uniformly distributed over the cross-section. The electric conductor wires are preferably either twisted (5) or woven (6).

Gas cooled current lead for superconducting machine

A super-conductive wire includes a plurality of super-conductive filaments embedded within a metal matrix. A heat shield layer is circumferentially disposed about the matrix so as to prevent the ingress of diffusion of heat into the matrix from the exterior of the wire, and a plurality of longitudinally extending grooves are defined within the surface portion of the wire to such a radial depth as to penetrate the heat shield layer and therefore permit the matrix of the wire to be in direct thermal contact with a coolant disposed about the exterior of the wire so as to permit heat within the matrix to be discharged therefrom to the exteriorly disposed coolant.

Super conductive wire

High current capacity superconductor

A superconductive coil includes a plurality of pancake coils made of superconductive wires which each have cooling surface and on each of which first and second fine grooves are respectively formed in different directions wherein the first fine grooves are formed in a step of preparing the superconductive wires and the second fine channels are formed on the pancake coils which is constructed by winding said superconductive wires having the first fine grooves in the form of a pancake.

Superconductive coil

A novel composite superconductor includes a superconducting material and a normal conducting material. The composite superconductor has a number of closely spaced grooves on a surface being in contact with a refrigerant, and a number of ridges spaced apart from each other by the grooves and having acutely tapered ends. The surfaces of the grooves and the ridges are coated with a thin film of metal or its compound having higher heat resistance than that of the surface of the composite superconductor. Consequently, a high critical heat flux in film boiling and a high cooling capability can be provided, thereby making it possible to decrease the sectional area of the normal conducting material, to increase the effective current density and to miniaturize the size of a magnet.

Composite superconductors

Growing community of inventors

Ibaraki, Japan

Susumu Shimamoto