Sharp Kabushiki Kaisha Corporation

Sanyo Electric Co., Ltd.

Susumu Omi

Shigetoshi Ito

Toshiyuki Kawakami

Tomoki Ono

Yukio Yamasaki

Toshiyuki Okumura

Kazuhiko Inoguchi

Kunihiro Takatani

Kazuya Fujita

In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.

GaN-based laser device

GaN laser element

In one embodiment of the present invention, a long-life nitride semiconductor laser element is disclosed wherein voltage characteristics do not deteriorate even when the element is driven at high current density. Specifically disclosed is a nitride semiconductor laser element which includes a p-type nitride semiconductor and a p-side electrode formed on the p-type nitride semiconductor. In at least one embodiment, the p-side electrode has a first layer which is in direct contact with the p-type nitride semiconductor and a conductive second layer formed on the first layer, and the second layer contains a metal element selected from the group consisting of Ti, Zr, Hf, W, Mo and Nb, and an oxygen element.

Nitride semiconductor laser device and nitride semiconductor laser apparatus

According to an aspect of the present invention, a nitride semiconductor laser device includes a nitride semiconductor active layer, and a stripe-shaped waveguide for guiding light generated in the active layer. At least one pair of light-absorbing films are provided in at least local regions on the opposite sides of the stripe-shaped waveguide, to reach a distance within 0.3 &#x3bc;m from the waveguide. According to another aspect of the present invention, a gan-based semiconductor laser device includes first conductivity type semiconductor layers, a semiconductor active layer and second conductivity type semiconductor layers stacked sequentially. The laser device further includes a ridge stripe provided to cause a refractive index difference for confinement of light in a lateral direction crossing a longitudinal direction of a cavity, and a current-introducing window portion provided on the ridge stripe. The current-introducing window portion includes a narrow portion that is locally narrowed compared to the width of the ridge stripe.

GaN-based semiconductor laser device

In a wafer having an LD structureformed on a GaN-based substrate, cleavage guide groovesare formed in its surface by scribing from above the LD structurewith a diamond needle. The cleavage guide groovesare formed one along each of stripe-shaped waveguidesformed parallel to the &#x3c;1-100&#x3e; direction of the wafer, and are formed in the shape of broken lines in the &#x3c;11-20&#x3e; direction of the wafer.

Method of fabricating nitride semiconductor device

A nitride-type compound semiconductor laser device includes a substrate and a layered structure provided on the substrate. A light absorption layer having a bandgap smaller than a bandgap of an active layer in the layered structure is provided in a position between the cladding layer, which is provided on a side opposite to a mount surface with respect to the active layer, and a surface of the layered structure which is opposite to the mount surface.

Nitride-type compound semiconductor laser device and laser apparatus incorporating the same

In a wafer having an LD structure formed on a GaN-based substrate , cleavage guide grooves are formed in its surface by scribing from above the LD structure with a diamond needle. The cleavage guide grooves are formed one along each of stripe-shaped waveguides formed parallel to the < - >direction of the wafer, and are formed in the shape of broken lines in the < - >direction of the wafer.

Nitride semiconductor device and fabrication method thereof

A semiconductor device is provided with: a semiconductor element having a mounting face; a lead frame including a die pad having an upper surface on which the semiconductor element is mounted with the mounting face facing to the upper surface of the die pad. The die pad has such an outer shape that a central portion of each sides opposed to each other is caved more inward than an outer shape of the mounting face of the semiconductor element. The semiconductor device is also provided with: a resin film coated on a lower surface of the die pad, and a portion of the mounting face of the semiconductor element, exposed at the central portion of each side of the die pad which is opposed to each other; and a package body made of molding compound for encapsulating the semiconductor element, the die pad and the resin film. The resin film is made of resin having a high adhesiveness with respect to the semiconductor element, the die pad and the molding compound of the package body.

Growing community of inventors

Kitakatsuragi-gun, Japan

Susumu Omi