Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Susumu Matsuoka

Masayoshi Koyama

Seiichi Nakatani

Yoshihiro Bessho

Takeshi Suzuki

Fumio Echigo

Satoru Tomekawa

Tatsuo Ogawa

Yasuhiro Nakatani

Daizo Andoh

Yasushi Taniguchi

Yoji Ueda

Chihiro Nakamura

Tsukasa Hashimoto

Tomoya Maeda

Takafumi Kaneda

Kiyohiko Kitagawa

Takashi Kitae

Seiji Karashima

Norihito Tsukahara

Satoru Yuhaku

Yoshitake Hayashi

Kazuo Otani

A circuit board in which end faces () of wires are located in positions withdrawn from the end in a joint region of a first board (), end faces () of wires are located in positions withdrawn from the end in a joint region of a second board (), a gap (W) between the end faces () of the wires of the first board () and the end faces () of the wires of the second board () is filled with a conductor (A), and the first board () and the second board () are jointed by means of a resin.

Circuit board and method for jointing circuit board

In a method for forming bumpson electrodesof a wiring board, a fluidcontaining conductive particlesand a gas bubble generating agent is supplied onto a first regionincluding the electrodeson the wiring board. Then, a substratewhich has a protruding surfacehaving the same area as that of the first regionand formed on a main surfaceof the substratehaving a larger area than that of the first regionis disposed so that the protruding surfacefaces the first regionof the wiring board. Then, the fluidis heated to generate gas bubblesfrom the gas bubble generating agent contained in the fluid

Bump forming method and bump forming apparatus

A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Method for manufacturing component built-in module, and component built-in module

A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

Method of producing a circuit board

Circuit board and production of the same

A liquid crystal material filling apparatus which includes, in a vacuum chamber, a liquid crystal pot having a liquid crystal reservoir for storing a liquid crystal material. A groove part is coupled with the liquid crystal reservoir at a certain angle and contains a medium for holding the liquid crystal material. A filling jig cassette is provided to accommodate a plurality of liquid crystal panels having injection ports faced downwardly, and an elevation device is provided for moving the liquid crystal pot up and down. Also, a posture control mechanism is provided for switching a posture of the liquid crystal pot in accordance with the up/down movement of the liquid crystal pot thereby to cause the liquid crystal material to flow from the liquid crystal reservoir to the groove part at a raised position and bring the medium in touch with lower faces of the injection ports of the liquid crystal panels.

Apparatus for filling liquid crystal material

Method and apparatus for filling liquid crystal material

Growing community of inventors

Osaka, Japan

Susumu Matsuoka