Dexerials Corporation

Canon Kabushiki Kaisha

Susumu Kumakura

Morio Sekiguchi

Yasunobu Yamada

A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mmor more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6&#x2264;B/A&#x2264;1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100&#xb0; C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Mounting body manufacturing method and anisotropic conductive film

An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10&#xb0; C. to 250&#xb0; C. and a heating speed is 10&#xb0; C./min, and wherein T2 is 30&#xb0; C. or higher, and T4&#x2212;T2 is greater than 0&#xb0; C. but 80&#xb0; C. or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

Anisotropic conductive film, connection method, and joined body

Provided is an electronic circuit device in which the bonding state of electrodes can be detected easily with high precision. The electronic circuit device has a stack structure in which a plurality of electronic circuit boards () are stacked in three or more layers through ball electrodes () bonded to electrode pads (), wherein the electrode pads are disposed such that transmission shaded images of a pair of the electrode pads provided between adjacent layers partially overlap each other and have a non-overlapping region in which the transmission shaded images of the pair of electrode pads are free from overlapping and such that the transmission shaded image of the non-overlapping region is at least partially free from overlapping with transmission shaded images of all the other electrode pads.

Growing community of inventors

Kanuma, Japan

Susumu Kumakura