Fujitsu Corporation

Susumu Kida

Ei Yano

Shigeyuki Maruyama

Naoyuki Watanabe

Takafumi Hashitani

Ichiro Midorikawa

Hideji Aoki

Hideo Suzuki

Toshiyuki Honda

Yuji Akashi

Yosuke Hirumuta

Hayato Usami

Yuki Kanazawa

Shokichi Shimizu

A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

Contactor having conductive particles in a hole as a contact electrode

A semiconductor device for picking up an image includes a lens-mounting unit provided with a lens for picking up an image; a semiconductor chip having a light-receiving element formed on a circuit-forming surface thereof, the light-receiving element converting light from the lens into an image signal; a flexible substrate provided between the lens-mounting unit and the semiconductor chip so as to supply the image signal to an external circuit; and a shading plate blocking light transmitting through the flexible substrate toward the semiconductor chip so as to substantially remove an influence of the light on the light-receiving element.

Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays

A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.

Semiconductor device with leads engaged with notches

A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.

Package for electronic device and method for producing same

A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.

Highly reliable hermetically sealed package for a semiconductor device

Growing community of inventors

Kawasaki, Japan

Susumu Kida