Ibiden Company Limited

Other

Susumu Kagohashi

Satoru Kawai

Hiroshi Tanaka

Katsuhiko Tanno

Ayao Niki

Kentaro Wada

Kazuhisa Kitajima

Kyohei Yoshikawa

Ryo Aoki

Ayumi Suzuki

Yukari Kajiyama

A wiring substrate includes an insulating layer including inorganic particles and resin, a seed layer formed on a surface of the insulating layer, and a conductor layer including a conductor pattern and formed on the seed layer. The surface of the insulating layer is a roughened surface formed such that the roughened surface of the insulating layer has exposed portions of the inorganic particles and resin with gaps at interfaces where the inorganic particles and the resin are in contact, and the seed layer is formed on the roughened surface of the insulating layer such that the seed layer is formed along the exposed portions of the inorganic particles and resin exposed on the roughened surface of the insulating layer and is not formed in the gaps at the interfaces where the inorganic particles and the resin are in contact.

Wiring substrate and method for manufacturing the same

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

Printed wiring board

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in an opening formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface of the insulating layer in the opening, and a third portion formed on the first conductor layer exposed from the opening and that the first portion has a thickness that is greater than a thickness of the second portion and a thickness of the third portion.

A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.

A roll coater with which an interlaminar resin insulating layer and/or a solder resist layer can be formed with good thickness uniformity to enable the manufacture of a printed circuit board free from the no-hole defect and anomalies in the diameter and geometry of the holes for via-hole and/or solder bump which is due to uneven layer thickness, thus having high electrical integrity and reliability. This roll coater is used for forming an interlaminar resin insulating layer and/or a solder resist layer in the manufacture of a printed circuit board including a substrate and, as serially built up thereon, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition, with a solder resist layer formed on top of the resulting multilayer structure, which comprises rolls each having a surface formed with a multiplicity of grooves running in the direction of roll rotation, with the grooves in the roll-end or marginal areas of the surface being relatively reduced in depth as compared with the remaining area.

Growing community of inventors

Ogaki, Japan

Susumu Kagohashi