Rohm Co., Ltd.

Ase Japan Co., Ltd.

Susumu Fukui

Kentaro Nasu

Kanako Deguchi

Takaki Takahashi

A semiconductor device includes a first lead, a semiconductor element, a sealing resin, a first plating layer, and a second plating layer. The first lead has a first obverse surface and a first reverse surface facing opposite from each other in a thickness direction and a first recess recessed from the first reverse surface toward the first obverse surface. The semiconductor element is mounted on the first obverse surface. The sealing resin covers the semiconductor element. The first plating layer is formed in contact with the first obverse surface and the first reverse surface. The first recess is exposed from the sealing resin. The first plating layer includes a first portion covering the first reverse surface. The second plating layer is formed in contact with the first recess and the first portion.

Growing community of inventors

Yamagata, Japan

Susumu Fukui