Nippon Chemi-Con Corporation

Susumu Ando

Ikuo Hagiwara

Yutaka Yokoyama

Akihiro Shimada

Makoto Hirano

Masayuki Fujiwara

Shigeki Shirase

Keiichi Endo

A positive electrodeand negative electrodeformed of a thin metal plate are disposed on the same plane with a space provided therebetween. An insulative resin is disposed in the space between the both electrodes. The insulative resin electrically insulates the positive and the negative electrodes, and making both electrodes integrated as a sheet to form a terminal board. Positive- and negative-electrode drawing portions are formed on the same surface of the main body of a capacitor element, and that surface serves as a joined face with the terminal board. With the terminal board being superimposed on the joined face of the capacitor element, the metal plate forming the positive and negative electrodes of the terminal board are electrically coupled to the positive- and negative-electrode drawing portions of the element, respectively.

Solid electrolytic capacitor

A chip type solid electrolytic capacitor comprises a plurality of anode plates on each of which an oxide thin layer, an electrolyte layer and a conductive layer are in turn formed, and a cathode plate interposed between the conductive layers of the plurality of anode plates when the anode plates are integratedly combined such that the respective conductive layers thereof are opposed to each other. Also, a method of producing the capacitor comprises the steps of forming layers on a plurality of anode plates, combining the anode plates, sealing a clearance between the anode plates with an insulating material, and bending a cathode plate and its terminal along an outer surface of the anode plate.

Solid electrolytic capacitor and a method of producing the same

There is disclosed a chip type capacitor characterized by comprising a capacitor having lead wires derived from a terminal thereof and a sheathing frame having an accommodating space compatible with a dimension of an external shape of said capacitor, wherein a protuberance of a height substantially identical to the dimension of an external diameter of the lead wires of the capacitor is provided on the underside of the sheathing frame and the lead wires of the capacitor accommodated in the sheathing frame are bent alongside from an end of the aperture of the sheathing frame to the underside of the sheathing.

Chip type capacitor and manufacturing thereof

There is disclosed a chip type capacitor in which the capacitor is accommodated in a sheathing frame having the receiving space compatible with an external size of the capacitor, terminals derived from the same open end of the capacitor are bent along the open end and the top surface of the sheathing frame and a solderable metal layer is arranged in a part of the top surface thereof.

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Tokyo, Japan

Susumu Ando