Applied Materials, Inc.

Sushil Arun Samant

Martin Lee Riker

Fuhong Zhang

Prashanth Kothnur

Goichi Yoshidome

Wei Lei

Shirish A Pethe

Kishor Kumar Kalathiparambil

Suhas Bangalore Umesh

Andrew Tomko

Methods of processing a substrate in a PVD chamber are provided herein. In some embodiments, a method of processing a substrate in a PVD chamber, includes: sputtering material from a target disposed in the PVD chamber and onto a substrate, wherein at least some of the material sputtered from the target is guided to the substrate through a magnetic field provided by one or more upper magnets disposed about a processing volume of the PVD chamber above a support pedestal for the substrate in the PVD chamber, one or more first magnets disposed about the support pedestal and providing an increased magnetic field strength at an edge region of the substrate, and one or more second magnets disposed below the support pedestal that increase a magnetic field strength at a central region of the substrate.

Methods for shaping magnetic fields during semiconductor processing

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Thane, India

Sushil Arun Samant