Cisco Technology, Inc.

Susheela N Narasimhan

Hong Huynh

Nguyen Nguyen

Mohammad Reza Danesh Kadivar

Mudasir Ahmad

Saeed Seyed

James Thomas Theodoras

Anthony King

Wingo Cheong

Michael Koken

Hang Tran

Branimir Tasic

John Borg

Saeed Sayed

Nguyen T Nguyen

In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.

Aligning bracket

An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.

Techniques utilizing thermal, EMI and FIPS friendly electronic modules

Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.

Heatsink attachment mechanism

A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder is mounted to respective surface mount pads of the circuit board using a surface mount technology soldering process. The heat sink assembly further includes a clip having a first portion configured to fasten to the first clip holder, a second portion configured to fasten to the second clip holder, and a third portion coupled to the first and second portions. The third portion is configured to position the heat sink adjacent the circuit board component when the first and second portions are respectively fastened to the first and second clip holders.

Methods and apparatus for installing a heat sink using surface mount technology

A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-&#xe0;-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.

Techniques for cooling a circuit board component within an environment with little or no forced convection airflow

The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for heat transfer from the circuit board component to the support member. The bend portion of the heat sink allows for displacement of the device portion relative to the support portion to limit the amount of stress generated by the heat sink on the circuit board component. The geometry of the heat sink further allows placement of the heat sink within the relatively narrow space conventionally formed between the circuit board and the support member.

Growing community of inventors

Milpitas, CA, United States of America

Susheela N Narasimhan