Wacker-chemie Gmbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Susanne Weizbauer

Hanns Wochner

Theresia Bauer

Josef Dietl

Dieter Seifert

Werner Ott

Wilhelm Schmidbauer

Herbert Pichler

Alfred Bergler

Semiconductor material has a low metal concentration at the surface. The semiconductor material has an iron content and/or chromium content on the surface of less than 6.66&times;10,g/cm,. A method for producing this semiconductor material includes a preliminary cleaning, a main cleaning and hydrophilization. A device for use in this method has a container with pyramid-shaped recesses at the bottom.

Method for producing a semiconductor material

A process is taught for etching semiconductor wafers with an etching mixture comprising nitric and hydrofluoric acids and optionally a surfactant. To this mixture are added either more hydrofluoric acid, or more hydrofluoric and nitric acids, with the added acids having concentrations of at least 70% by weight. The use of concentrated acids reduces the loss of substrate material and extends etching bath life.

Process for etching semiconductor wafers

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Rosenheim, Germany

Susanne Weizbauer