Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft F&uuml;r Halbleiter Materialien Ag

Susanne Bauer-Mayer

Roland Brunner

Rudolf Griesshammer

Peter John

Laszlo Fabry

Helmut Kirschner

Hans-Joachim Luthe

Franz Sollinger

Manfred Grundner

Dieter Graef

Georg-Friedrich Hohl

G&uuml;nther Brunner

A centrifuge for a semiconductor wafer has a centrifuge plate for holding a semiconductor wafer, has a drive for setting the centrifuge plate in rotation, and has a device for supplying a medium to a front side and a rear side of the semiconductor wafer. The centrifuge has a housing which separates a centrifuging area and the semiconductor wafer from the environment, and a device for generating a laminar gas flow in the housing. A method for centrifuging a semiconductor wafer has the semiconductor wafer being centrifuged in a laminar gas flow.

Centrifuge and method for centrifuging a semiconductor wafer

A process for producing silicon wafers which have a storage-stable surface and which can be thermally oxidized directly, that is to say, without a prior HF immersion bath, and without the addition of halogen-containing gases, it being possible to achieve an equal or better oxidation result than that achieved by including these measures.

Process for producing storage-stable silicon wafer surfaces having

Silicon wafers can be provided with a hydrophilic surface and/or freed of hering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These processes can even be carried out at room temperature and are remarkable for their low chemical consumption and easy manageability.

Process for the hydrophilizing and/or cement-residue-removing surface

Growing community of inventors

Burghausen, Germany

Susanne Bauer-Mayer