Hewlett-Packard Company

Susannah Gardner

Bertram Kim Cheong Chan

Hans T Mellberg

Gwen M Bertolami

Herman W Chu

Lee Wical

An EMI reduction device is interposed between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device contacts a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

EMI reduction device and assembly

The present invention provides a bezel attachment configuration for securing a detachable bezel to a metal chassis. The bezel attachment mechanism preferably includes the combination of a modified bezel post extending from and integral to the plastic body of the bezel and a bezel snap that is attached to the post. The post includes at least a first region and a second region, where the cross-sectional area of the second region is less than the cross-sectional area of the first region. The difference in cross-sectional areas creates a lip between the first region and the second region that the bezel snap catches on if moved in an upward direction towards the top of the bezel post. The lip of the post acts as a barrier to further movement of the bezel snap, thus providing a secure attachment of the bezel snap to the bezel. The secure bezel snap is inserted into an opening in the metal chassis.

Bezel snap for computer chassis

An EMI reduction device is coupled between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

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San Carlos, CA, United States of America

Susannah Gardner