Dow Corning Corporation

Michigan Molecular Institute

Dendritech Inc.

Other

Susan Victoria Perz

Michael James Owen

Toshio Suzuki

Gary R Homan

Maris J Ziemelis

Petar Radivoj Dvornic

Shedric Oneal Glover

Michael Ward Skinner

Michael A Lutz

Agnes M deLeuze-Jallouli

Qian Jane Feng

Kenneth Michael Lee

Valerie Joy Bujanowski

John Patrick Cannady

Maneesh Bahadur

Valeris J Bujanowski

Jin Hu

Robert E Kalinowski

Douglas R Swanson

Ludmil M Zambov

Lajos Balogh

Vasgen Aram Shamamian

Jeffrey Alan Seifferly

Ralph Spindler

Agnes M De Leuze-Jallouli

Scott Daniel Reeves

Paul Lane Parham

The present invention provides a method of forming a flexible dichroic optical filter. The method comprises depositing a plurality of pairs of layers adjacent a substrate. Each of the plurality of pairs of layers includes a first layer formed of a silicon-and-carbon containing material having a first index of refraction and a second layer formed of a silicon-and-carbon containing material having a second index of refraction that is different than the first index of refraction.

Dichroic filters formed using silicon carbide based layers

This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds, epoxy functional compounds, or compounds having the formula R X , wherein R is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.

Radiation curable compositions containing alkenyl ether functional polyisobutylenes

This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds or compounds having the formula R X , wherein R is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.

Silicon containing multi-arm star polymers

The adhesion of cured polyolefin compositions to a variety of substrates is improved using as the adhesion promoter the combination of 1) an organic or organosilicon compound containing at least one epoxy group and 2) at least one compound containing a) at least one silanol or carbinol group or a hydrolyzable silanol group precursor, and b) at least one group that reacts during curing of the polyolefin.

Curable polyolefin compositions containing organosilicon compounds as

Higher generation radially layered copolymeric dendrimers having a hydrophilic poly(amidoamine) or a hydrophilic poly(propyleneimine) interior and a hydrophobic organosilicon exterior are prepared by first reacting a hydrophilic dendrimer having --NH.sub.2 surface groups with an organosilicon compound, and then hydrosilating the resulting copolymeric dendrimer with another organosilicon compound in the presence of a noble metal catalyst. In an alternate embodiment, the radially layered copolymeric dendrimers are prepared by reacting a hydrophilic dendrimer having --NH.sub.2 surface groups directly with an organosilicon dendron or organosilicon hyperbranched polymer.

High generation radially layered dendrimers

The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.

The present invention provides adhesion promoters for curable polyolefin compositions wherein said adhesion promoters are selected from a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds. At least one hydrocarbyloxy group on each silicon atom of the adhesion promoter is derived from a polyhydric alcohol containing at least two hydroxyl groups per molecule and substantially no ethylenic unsaturation.

Polyolefin compositions containing organosilicon compounds as adhesion

This invention relates to organosilicon compositions useful as adhesion promoters for curable organopolysiloxanes, said organosilicon compositions being formed by reacting (A) a polyhydric alcohol, (B) an organosiloxane containing at least one organofunctional group and one hydroxyl or hydrolyzable group per molecule and (C) a silane containing at least three hydrolyzable groups per molecule.

Adhesion promoting organosilicon compositions

Dendritic polymer based networks consisting of well-defined hydrophilic and oleophilic (i.e., hydrophobic) domains, are capable of performing as nanoscopic sponges for electrophilic guest moieties such as (i) inorganic and organic cations; (ii) charged or polarized molecules containing electrophilic constituent atoms or atomic groups; and (iii) other electrophilic organic, inorganic, or organometallic species. As a result of such performance, the networks yield novel nanoscopic organo-inorganic composites which contain organosilicon units as an integral part of their covalently bonded matrix.

Dendrimer-based nanoscopic sponges and metal composites

Dendrimer-based networks are prepared from copolydendrimer precursors having well defined hydrophilic polyamidoamine (PAMAM) or polypropyleneimine (PPI) interiors, and organosilicon outer layers ending with .tbd.Si--OCH.sub.3 surface groups. These networks have precisely controllable size, shape, and spatial distribution, of nanoscopic hydrophilic and hydrophobic domains. Such constructs are prepared by crosslinking one type of copolydendrimer precursor, or by crosslinking mixtures of different copolydendrimers having different generations of PAMAM or PPI dendrimers in the interior, surrounded by different organosilicon exteriors. Crosslinking can be controlled by adding difunctional, trifunctional, or polyfunctional low molecular weight or oligomeric crosslinking agents; or by exposing a copolydendrimer having hydrolyzable surface groups to atmospheric moisture. Elastomeric dendrimer-based networks have low glass temperatures of -15.degree. C. or below, are optically clear, transparent, colorless; and have a non-stick surface which can be formed into films of small thickness.

Dendrimer-based networks containing lyophilic organosilicon and

The present invention relates to radiation curable silicone vinyl ethers and methods for preparing silicone vinyl ethers. More particularly, the present invention relates compositions containing vinyl ether functional silicones and to the preparation and use of silicone vinyl ethers which are curable by addition of photocleavable acids and exposure to ultraviolet or electron beam radiation.

Radiation curable siloxane compositions containing vinyl ether

Radiation curable compositions containing vinyl ether functionality and

Radially layered copoly-dendrimers having unusual surface properties and novel applications have been synthesized and characterized. These are the first copolymeric dendrimers composed of a hydrophilic poly(amidoamine) (PAMAM) interior with hydrophobic organosilicon surfaces. These dendrimers have been prepared by surface modifications of an ethylene diamine core PAMAM dendrimer with (3-acryloxypropyl)methyldimethoxysilane, (3-acryloxypropyl)bis(vinyldimethylsiloxy)methylsilane, (3-acryloxypropyl)tris(trimethylsiloxy)silane, chloromethyltrimethylsilane, and chloromethyldimethylvinylsilane, to varying degrees of surface coverage. The obtained products were characterized by .sup.1 H, .sup.13 C, and .sup.29 Si NMR, and by DSC and TGA. The dendrimers with less completely covered organosilicon surfaces are water soluble, and have considerable surface activity, the best of which lowered the surface tension of water to less than 30 mN/m. Areas in their surface, according to the Gibbs adsorption isotherm, are surprisingly small, i.e., of the order of 100 .ANG..sup.2 /mol. More completely hydrophobed dendrimers are water insoluble, and form spread monolayers on water, capable of sustaining surface pressures over 40 mN/m. Areas per molecule are in the 1,000 .ANG..sup.2 /mol range.

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Essexville, MI, United States of America

Susan Victoria Perz