Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Susan K Radford

Sachin Navin Chheda

Gerald John D'Amato

Heather L Volesky

The present invention provides a method and system that is capable of identifying an event type from a plurality of event types to direct an event translator to determine an event occurrence based on the event type. A method is provided for identifying the event type from a plurality of event types, determining an event occurrence based on the event type; and communicating the event occurrence. A system is also described.

Method and system for supporting a plurality of event types

The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

Hybrid BGA and QFP chip package assembly and process for same

Printed circuit board has first, second and third sets of connection points operable to connects to first, second and third integrated circuits. Each set of connection points is arranged in a grid pattern having a center pairs of orthogonal axes intersect. The grids define parallel planes. The pairs of orthogonal axes of the second grid are rotated counterclockwise relative to those of the first grid by at least 5 but not more than 25 degrees. Signal connection points in the first and second grids are concentrated in corners closet to the center of the third grid. Signal connection points in the third grid are concentrated in the half closest to the centers of the first and second grids. Alternatively, when signal connection points are concentrated elsewhere in the grid, the pairs of axes for the second grid are rotated relative to those of the first by an amount other than 0, 45, 90, 135, 180, 225, 270 and 315 degrees. First and second sets of mounting holes attach first and second heat dissipators. The second set of mounting holes is rotated relative to the first by either 0, 90, 180 or 270 degrees. First conductive traces connect signal connection points in the third grid to signal connection points in the grid. Second conductive traces connect the signal connection points in the grid to signal connection points in the second grid. The aggregate conductive paths, formed from die to die by the first and second sets of conductive traces and the corresponding conductors internal to the chip packages, all have the same length.

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Fort Collins, CO, United States of America

Susan K Radford