Honeywell International Inc.

Johnson Matthey Inc.

Susan D Strothers

Stephane Ferrasse

Patrick K Underwood

Frank C Alford

Jaeyeon Kim

Janine K Kardokus

Michael D Payton

Scott R Sayles

Marc D Ruggiero

Wayne D Meyer

Anthony F Beier

Shih-Yao Lin

Michael R Pinter

Chi Tse Wu

Vladimir M Segal

Brett M Clark

William B Willett

Ritesh P Shah

Werner Hort

Suresh Sundarraj

David E Steele

Robert Prater

Ira G Nolander

Wuwen Yi

Robert G Delano

Ravi Rastogi

Lucia M Feng

Jeffrey J Schaefer

Susanne Grabmeier

Andrew Wragg

William R Turner

Frank A Alford

Garold L Steed

Patrick Underwood

Diane L Morales

Xinlin Shi

A high strength aluminum alloy material comprises aluminum as a primary component and at least one of magnesium and silicon as a secondary component at a concentration of at least 0.2% by weight. The material has a Brinell hardness of at least 90 BHN, a yield strength of at least 250 MPa, an ultimate tensile strength of at least 275 MPa, and a percent elongation of at least 11.5%.

ECAE processing for high strength and high hardness aluminum alloys

An aluminum or copper alloy sputtering chamber includes a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the front surface A coating of titanium particles is formed on the sputter trap.

Sputter trap having a thin high purity coating layer and method of making the same

A method of forming a high strength aluminum alloy is disclosed. The method includes solutionizing to a temperature ranging from about 5&#xb0; C. above a standard solutionizing temperature to about 5&#xb0; C. below an incipient melting temperature for the aluminum material to form a heated aluminum material, which is then quenched. The aluminum material includes at least one of magnesium and silicon as a secondary component at a concentration of at least 0.2% by weight. The cooled aluminum material is subjected to ECAE processing using one of isothermal conditions and non-isothermal conditions. Isothermal conditions include having a billet and a die at the same temperature from about 80&#xb0; C. to about 200&#xb0; C. Non-isothermal conditions include having a billet at a temperature from about 80&#xb0; C. to about 200&#xb0; C. and a die at a temperature of at most 100&#xb0; C. The aluminum material is than aged at a temperature from about 100&#xb0; C. to about 175&#xb0; C.

A sputtering chamber component including a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the back surface, and a coating of metallic particles formed on the sputter trap. The coating has a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is substantially free of impurities, and the particles of the coating are substantially diffused.

The present disclosure relates generally to a planar sputtering target. In particular, the present disclosure provides a planar sputtering target comprising a planar sputtering surface and a back surface opposite the planar sputtering surface. The planar sputtering target is formed from a 2N purity tin having an average grain size from at least 10 mm to at most 100 mm. The present disclosure provides a method of manufacturing the tin planar sputtering target having an average grain size from at least 10 mm to at most 100 mm.

Large-grain tin sputtering target

Disclosed herein is a method of forming a high strength aluminum alloy. The method comprises heating an aluminum material to a solutionizing temperature for a solutionizing time such that the magnesium and zinc are dispersed throughout the extruded aluminum material to form a solutionized aluminum material. The method includes quenching the solutionized aluminum material to form a quenched aluminum material. The method also includes aging the quenched aluminum material to form an aluminum alloy, then subjecting the aluminum alloy to an ECAE process to form a high strength aluminum alloy.

ECAE materials for high strength aluminum alloys

A sputtering target comprising a forged aluminum material having an average grain size between about 15 and 55 microns. The aluminum material has at least one of the following: a homogeneous texture with minimal texture banding as measured by banding factor B below about 0.01; a texture gradient H of less than 0.2; or either weak (200) texture or near random texture characterized by maximum intensity of inverse pole figure less than 3 times random in multiple directions.

Frictionless forged aluminum alloy sputtering target with improved properties

A method of forming a high strength aluminum alloy. The method comprises subjecting an aluminum material containing at least one of magnesium, manganese, silicon, copper, and zinc at a concentration of at least 0.1% by weight to an equal channel angular extrusion (ECAE) process. The method produces a high strength aluminum alloy having an average grain size from about 0.2 &#x3bc;m to about 0.8 &#x3bc;m and a yield strength from about 300 MPa to about 650 MPa.

A sputter trap formed on at least a portion of a sputtering chamber component has a plurality of particles and a particle size distribution plot with at least two different distributions. A method of forming a sputter trap having a particle size distribution plot with at least two different distributions is also provided.

Sputter trap having multimodal particle size distribution

A method of forming a high strength aluminum alloy. The method comprises heating an aluminum material including scandium to a solutionizing temperature of the aluminum material such that scandium is dispersed throughout the aluminum material to form an aluminum alloy. The method further comprises extruding the aluminum alloy with equal channel angular extrusion to form a high strength aluminum alloy, such that the high strength aluminum alloy has a yield strength greater than about 40 ksi after being at a temperature from about 300&#xb0; C. to about 400&#xb0; C. for at least one hour.

High strength aluminum alloy backing plate and methods of making

A method of forming a high strength copper alloy. The method comprises heating a copper material including from about 2 wt. % to about 20 wt. % manganese by weight of the copper material to a temperature above 400&#xb0; C., allowing the copper material to cool to a temperature from about 325&#xb0; C. to about 350&#xb0; C. to form a cooled copper material, and extruding the cooled copper material with equal channel angular extrusion to form a cooled copper manganese alloy.

Copper manganese sputtering target

The invention includes a method of detecting impurities in a metal-containing article. A portion of metal material is removed from a metal article and is solubilized in an acid or base-comprising liquid to produce a liquid sample. The liquid sample is subjected to an incident laser beam and light scattered from the sample is detected. The invention includes a method of analyzing a physical vapor deposition target material. A portion of target material is removed from the target and is rinsed with an acid-comprising solution. The portion of target material is dissolved to produce a liquid sample. The sample is subjected to an incident laser beam and scatter of the laser beam is detected to determine the number of particles present in the sample within a particular size range.

Liquid-particle analysis of metal materials

The invention includes a copper-comprising sputtering target. The target is monolithic or bonded and contains at least 99.99% copper by weight and has an average grain size of from 1 micron to 50 microns. The copper-comprising target has a yield strength of greater than or equal to about 15 ksi and a Brinell hardness (HB) of greater than about 40. The invention includes copper alloy monolithic and bonded sputtering targets consisting essentially of less than or equal to about 99.99% copper by weight and a total amount of alloying element(s) of at least 100 ppm and less than 10% by weight. The targets have an average grain size of from less than 1 micron to 50 microns and have a grain size non-uniformity of less than about 15% standard deviation (1-sigma) throughout the target. The invention additionally includes methods of producing bonded and monolithic copper and copper alloy targets.

Growing community of inventors

Mead, WA, United States of America

Susan D Strothers