Frore Systems Inc.

Qualcomm Incorporated

Qualcomm Mems Technologies, Inc.

Suryaprakash Ganti

Seshagiri Rao Madhavapeddy

Prabhu Sathyamurthy

Vikram Mukundan

David William Burns

Ananth Saran Yalamarthy

John Keith Schneider

Shekhar Halakatti

Eliza Yingzi Du

Narayana Prasad Rayapati

Clarence Chui

Manish Kothari

Brian James Gally

Teruo Sasagawa

Lumaya Ahmed

Kwokleung Chan

Leonard Eugene Fennell

Ming Yu Chen

Esra Vural

Hrishikesh Vijaykumar Panchawagh

Kostadin Dimitrov Djordjev

Prathima Kapa

Jeffrey Brian Sampsell

Ganapathy Sankar

Suchitra Ramesh

Mark W Miles

Ravindra Vaman Shenoy

Ming-Hau Tung

Jack Conway Kitchens

Marc Mignard

Samir Kumar Gupta

Chun-Ming Wang

Yipeng Lu

Jon Lasiter

Timothy Dickinson

Jonathan Charles Griffiths

Jack Conway Kitchens, Ii

Ashish Hinger

Nai-Kuei Kuo

Hao-Yen Tang

Nicholas Ian Buchan

Lennart Karl Mathe

Sandeep Louis D'Souza

Firas Sammoura

Muhammed Ibrahim Sezan

Meir Agassy

Masoud Roham

Jin Gu

Stephen Zee

Saurav Bandyopadhyay

Nathan Felix Altman

Wonsuk Chung

Vadim Winebrand

Sherman Sebastian Antao

Bo-Ren Wang

Paul Penchin Pan

Yizhaq Abudi

Micah Timothy Lawrence

Jong Soo Kim

Nilesh Sudhir Hasabnis

Ming Tung

Evgeni Petrovich Gousev

Jessica Liu Strohmann

Laurence Geoffrey Lundblade

Koorosh Aflatooni

Mark Bapst

Donald William Kidwell, Jr

Eugene Dantsker

Kollengode S Narayanan

Stephen Michael Gojevic

Chin-Jen Tseng

Livingstone Song

Farnaz Parhami

Tsongming Kao

Ila Ravindra Badge

George Michael Milikich

Jon Azen

Sangkyu Kim

Woo Sung Chung

William Finn Ninian Paisley

Ji Hoon Kim

Varun Prasanna Rajamuthu

Wen-Sheng Chan

Srikanth Chilukuru

Max Hamel

Ian Brettell

Ii Jack Conway Kitchens

Jon Bradley Lasiter

Timothy Alan Dickinson

Donald William Kidwell Jr

Timothy A Dickinson

A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.

MEMS-based system for cooling a vapor chamber

A system includes an active micro-electric mechanical system (MEMS) cooling system and a drive system. The MEMS cooling system includes cooling element(s) that direct fluid toward a surface of heat-generating structure(s) when driven to vibrate by a driving signal having a frequency and an input voltage. The drive system is coupled to the active MEMS cooling system and provides the driving signal. The drive system includes a power source and a feedback controller providing a feedback signal corresponding to a proximity to a resonant state of the at least one cooling element. The drive system adjusts at least one of the frequency and the input voltage based on the feedback signal such that the frequency corresponds to the resonant state of the cooling element(s). The input voltage does not exceed a maximum safe operating voltage for the cooling element(s).

Frequency lock in active mems cooling systems

Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.

Ultrasonic fingerprint sensor for under-display applications

A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.

Top chamber cavities for center-pinned actuators

A cooling system is described. The cooling system includes a cooling element and a support structure. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element includes a piezoelectric structure including a substrate having a first side and a second side opposite to the first side. A first piezoelectric layer is on the first side. A second piezoelectric layer is on the second side. The support structure is coupled to the cooling element and configured to support the cooling element.

Actuator designs for MEMS-based active cooling

A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.

Anchor and cavity configuration for MEMS-based cooling systems

A mobile device, such as a mobile phone, including a housing and active cooling cells is described. The active cooling cells are in the housing. The cooling cells utilize vibrational motion to drive a fluid such that the mobile phone has a coefficient of thermal spreading (CTS) greater than 0.5 for a steady-state power generated by the mobile phone of at least five watts.

Mobile device having a high coefficient of thermal spreading

An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

Engineered actuators usable in MEMs active cooling devices

A system including a cooling element and an egress passageway is described. The cooling element is configured to provide a stream of hot air having been heated by a heat from a heat-generating structure. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn to be mixed with the hot air.

Exhaust blending for piezoelectric cooling systems

A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.

Method for fabricating MEMS-based cooling systems

A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.

Integration of active MEMS cooling systems into thin computing devices

A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.

Tiles having multiple cooling cells for MEMS-based cooling

A flow chamber having an upper chamber, a lower chamber, and an actuator is described. The upper chamber includes a top wall. The actuator is located distally from the top wall. The lower chamber includes a bottom wall and a sidewall. The lower chamber receives a fluid from the upper chamber when the actuator is activated. The bottom wall has orifices and at least one cavity therein. The orifices are vertically aligned with a portion of the actuator and allow the fluid to exit the lower chamber. The at least one cavity is proximate to the sidewall and distally located from the orifices.

Cavities for center-pinned actuator cooling systems

An active cooling system includes at least one cooling element that has a vent therein. The active cooling element is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open when the virtual valve is closed.

Virtual valve in a MEMS-based cooling system

A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

Active heat sink

Growing community of inventors

Los Altos, CA, United States of America

Suryaprakash Ganti