Mindspeed Technologies, Inc.

Surinderjit S Dhaliwal

Xiaoming Li

Mishel Matioubian

There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated sufficient resources without wasteful power consumption resulting from ramping up of performance through overestimating of voltage or frequency increases. Additionally, power management may be planned for longer periods, rather than looking only at immediate data to be processed and constantly fluctuating voltage and frequency. In this manner, power management can run more smoothly and efficiently compared to conventional means of power management that ignore data from a scheduler when determining power management policy.

Scheduler with voltage management

There is provided a semiconductor package configured for externally controlled power management. Instead of integrating voltage regulation on-chip as done conventionally, power regulation is moved externally to the PCB level, providing numerous package advantages including size, simplicity, power efficiency, integration flexibility, and thermal dissipation. In particular, the use of flip-chip package configurations provides ready access to power supply bumps, which also allows the use of a universal receiving PCB and power supply through simple reconfiguring of voltage traces. As a result, flexible power management can be implemented, and portions of semiconductor packages may be managed for performance or thermal considerations, which may be of particular use for applications such as multi-core processors.

System on chip power management through package configuration

There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state.

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Laguna Niguel, CA, United States of America

Surinderjit S Dhaliwal