International Business Machines Corporation

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Siemens Aktiengesellschaft

Suri G Hedge

Ravikumar Ramachandran

Jeremy K Stephens

Michael Lester Wise

Paul Daniel Kirsch

Mark J Hurley

Jeremy John Kempisty

Lance Genicola

A method for monitoring a nitridation process, including: (a) providing a semiconductor substrate; (b) forming a first dielectric layer on a top surface of the substrate; (c) introducing a quantity of interfacial species into the substrate; (d) removing the first dielectric layer; (e) forming a second dielectric layer on the top surface of the substrate; (f) measuring the density of interface traps between the substrate and the second dielectric layer; (g) providing a predetermined relationship between the quantity of the interfacial species and the density of the interface traps; and (h) determining the quantity of the interfacial species introduced based on the relationship.

Method of monitoring introduction of interfacial species

Method of monitoring introduction on interfacial species

Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.

Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer

Methods and apparatus for chemical mechanical planarization (CMP) of a

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Hollowville, NY, United States of America

Suri G Hedge