Intel Corporation

Suresh V Pothukuchi

Johanna M Swan

John Stephen Guzek

Ravindranath Vithal Mahajan

Ravi Kiran Nalla

Donald Tiendung Tran

Vladimir K Tamarkin

Srikant Nekkanty

Ling Liao

Andrew Alduino

Mohit Mamodia

Drew W Delaney

Edward A Zarbock

David Hui

Sushrutha Reddy Gujjula

David M Bond

Harinadh Potluri

Omkar G Karhade

Zhichao Zhang

Javier Soto Gonzalez

Xiaoqian Li

Kemal Aygün

Sushrutha Gujjula

Javier Solo Gonzalez

David Bond

Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Optical multichip package with multiple system-on-chip dies

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Dual-sided co-packaged optics for high bandwidth networking applications

An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate.

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

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Chandler, AZ, United States of America

Suresh V Pothukuchi