Intel Corporation

Primarion Corporation

Zarlink Semiconductor Limited

Suresh V Golwalkar

Jonathan L McFarland

John M Burns

Noah Davis

Kannan Raj

Richard B Foehringer

Kevin J Cote

Wuchun Chou

Shigeo Kawashima

Michael Wentling

Ryo Takatsuki

Xue Yang

Robert T Carroll

Narayan Sundararajan

Romit Roy Choudhury

Mahanth Gowda

Phil McClay

Sampath K V Karikalan

Keiichi Tsujimoto

Nobuaki Sato

Lakshman Krishnamurthy

Saurin Shah

Manan Goel

Swarnendu Kar

Steven R Eskildsen

Francis M Tharappel

Thomas Duffy

John Ryan Goodfellow

C Phillip McClay

Wu Chun Chou

Tito Barrios

Systems and techniques for sensor-derived object flight performance tracking are described herein. A set of magnetometer readings may be obtained from a magnetometer included with an object. A local rotation axis of the object may be determined at a time using the set of magnetometer readings. The local rotation axis may describe rotation of the object around a local magnetic target. A global rotation axis may be calculated based on an initial orientation of the object. The global rotation axis may describe a fixed rotation axis of the object during flight in a global coordinate frame, wherein an angle between the global rotation axis and magnetic north remains constant during the flight. An orientation of the object may be determined for the time using the global rotation axis and the local rotation axis of the object at the time.

Sensor-derived object flight performance tracking

The present disclosure describes a number of embodiments related to devices, systems, and methods locating a an object using ultra-wide band (UWB) radio transceivers embedded in carpet or other flexible material that may be rolled up and moved to various locations. Once in a location, the carpet may be unrolled and the multiple embedded radio transceivers may receive a signal from a tag attached to the object sending UWB radio signals. Based on the signals received by the UWB radio transceivers, various processes including time-difference on arrival, time-of-flight, and phase shift may be used to determine the location or the movement of the object.

Ultra-wide band (UWB) radio-based object sensing

A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a&#x2014;light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same

A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing the overall parasitic inductance of the device. In one embodiment, the microelectronic component includes a semiconductor device coupled to a substrate, such as a lead frame, a first set of bond wires connected to the semiconductor device for providing current flow into the semiconductor device, and a second set of bond wires that are in a current loop with the first set of bond wires and are connected to the semiconductor device for providing current flow out of the semiconductor device, wherein the first and second set of bond wires are configured in an inter-digitated pattern to increase the magnitude of mutual inductive coupling between the first and second set of bond wires. In one embodiment, the semiconductor device comprises a single semiconductor chip and the lead frame comprises a Quad Flat No-Lead (QFN) lead frame. Other embodiments include multiple chips and/or multiple lead frames.

Microelectronic component with reduced parasitic inductance and method of fabricating

An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Apparatus and method of packaging two dimensional photonic array devices

A device for forming an optical connection between an optoelectronic device and an optical fiber, forming an electrical connection between the optoelectronic device and an integrated circuit, and a forming an electrical connection between the microelectronic device and a substrate, a system including the device, and a method of forming the device and system are disclosed. The device for forming an optical connection includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector portion of a fiber ribbon cable assembly, such that when the fiber ribbon connector is attached to the device, the transmission medium provides an optical path between the optoelectronic device and the fiber.

Apparatus for coupling an optoelectronic device to a fiber optic cable and a microelectronic device, a system including the apparatus, and a method of forming the same

A system for coupling optoelectronic devices, associated electrical components, and optical fibers is described. The system includes a substrate to which optoelectronic devices and at least some of the associated electronic components are formed on or formed using the substrate material. The substrate is further configured to receive and attach to one or more optical fibers. The system can be used to form transceivers for multiplexing and/or demultiplexing electronic information.

Optical interconnect structure, system and transceiver including the structure, and method of forming the same

A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Dual sided integrated circuit chip package with offset wire bonds and

Manufacturing dual sided wire bonded integrated circuit chip packages

A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated circuit die is disposed onto a first side and a second side of each die pad. Each integrated circuit die is wire bonded to the corresponding lead fingers. The temperature during the second side die attach and wire bonding steps is controlled and/or compatible materials are selected to prevent warping of the leadframe, and special steps are also implemented to eliminate mold flash, plastic mold cracking and overcuring and increasing the adhesion.

Method for constructing a dual sided, wire bonded integrated circuit

A method of producing surface features having topological variances in the scribeline areas of a wafer adjacent to the dies. Surface features are used to reduce fracturing of molding compound and to prevent movement of the molding compound with respect to the surface of a die in a plastic encapsulated integrated circuit.

Method of producing a scribelined layout structure for plastic

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Phoenix, AZ, United States of America

Suresh V Golwalkar