Alpha Assembly Solutions Inc.

Suresh Telu

Siuli Sarkar

Morgana De Avila Ribas

Pritha Choudhury

Anil K N Kumar

Anilkumar KN

Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150&#xb0; C., for example up to 175&#xb0; C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn&#x2014;Ag&#x2014;Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

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Bengaluru, India

Suresh Telu