Google Inc.

Rambus Inc.

Metaram, Inc.

Nvidia Corporation

Suresh Rajan

David T Wang

Michael John Sebastian Smith

Keith R Schakel

Frederick Daniel Weber

Frederick Abbott Ware

Scott C Best

Amir Amirkhany

David A Secker

Ian P Shaeffer

Ravindranath T Kollipara

Michael J S Smith

Thomas Vogelsang

Abhijit Mukun Abhyankar

Dinesh D Patil

Mohammad Hekmat

Ely K Tsern

Wayne Frederick Ellis

Philip Arnold Ferolito

Michael J Smith

Radoslav Danilak

Daniel L Rosenband

Min Wang

David Nguyen

Joseph Charles Fjelstad

Wael Zohni

Brent Steven Haukness

Sameer Nanda

Thomas A Maufer

Paul J Sidenblad

William P Schmidt

Jeremy Werner

Edward Wai Yeung Liu

Jeremy Plunkett

Michael John Sebastien Smith

Described are memory modules that include address-buffer components and data-buffer components that together support wide- and narrow-data modes. The address-buffer component manages communication between a memory controller and two sets of memory components. In the wide-data mode, the address-buffer enables memory components in each set and instructs the data-buffer components to communicate full-width read and write data by combining data from or to from both sets for each memory access. In the narrow-data mode, the address-buffer enables memory components in just one of the two sets and instructs the data-buffer components to half-width read and write data with one set per memory access.

High-performance, high-capacity memory modules and systems

A semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.

Semiconductor memory systems with on-die data buffering

The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

Load reduced memory module

A method of operation in an integrated circuit (IC) memory device is disclosed. The method includes refreshing a first group of storage rows in the IC memory device at a first refresh rate. A retention time for each of the rows is tested. The testing for a given row under test includes refreshing at a second refresh rate that is slower than the first refresh rate. The testing is interruptible based on an access request for data stored in the given row under test.

DRAM retention test method for dynamic error correction

A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

Folded memory modules

The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.

High capacity memory system using standard controller component

High performance, high capacity memory modules and systems

A memory controller and buffers on memory modules each operate in two modes, depending on the type of motherboard through which the controller and modules are connected. In a first mode, the controller transmits decoded chip-select signals independently to each module, and the motherboard data channel uses multi-drop connections to each module. In a second mode, the motherboard has point-to-point data channel and command address connections to each of the memory modules, and the controller transmits a fully encoded chip-select signal group to each module. The buffers operate modally to correctly select ranks or partial ranks of memory devices on one or more modules for each transaction, depending on the mode.

High capacity memory system with improved command-address and chip-select signaling mode

Growing community of inventors

San Jose, CA, United States of America

Suresh Rajan