Standard Telephones and Cables Public Limited Company

Standard Telephones & Cables Limited

Suresh M Ojha

Rudolf A Heinecke

Ian Paul Llewellyn

In a pulsed radio frequency plasma deposition process the pulse repetition frequency is matched to the gas exchange rate. This is achieved by using a pulse width of 50 to 500 microseconds and a pulse repetition rate corresponding to the time within which gas is exchanged in the reaction region.

Pulsed plasma process for treating a substrate

Discontinuities, e.g. scratches, in a plastics surface are removed by exposing the surface to a pulsed radio frequency plasma comprising a mixture of argon and hydrogen. After melting has been effected the surface is exposed to an argon plasma to effect cross-linking to form a smooth surface layer.

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Harlow, United Kingdom

Suresh M Ojha