Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology Portugal, S.a.

Suresh Jayaraman

Ronald Patrick Huemoeller

Eoin O'Toole

Andre Cardoso

David Jon Hiner

Won Chul Do

Ji Hun Lee

Bora Baloglu

Jin Young Khim

Ju Hong Shin

Fernando Teixeira

Marta Sa Santos

Kye Ryung Kim

Jae Yoon Kim

Jose Luis Silva

Luis Alves

Jose Moreira Da Silva

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Semiconductor devices and methods of manufacturing semiconductor devices

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.

Growing community of inventors

Gilbert, AZ, United States of America

Suresh Jayaraman