Sony Corporation

Praxair S.t. Technology, Inc.

Materials Research Corporation

Suresh Annavarapu

Paul S Gilman

Thomas J Hunt

Tony Sica

John Ettlinger

A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.

Sputter target/backing plate assembly and method of making same

A high purity titanium polycrystalline target with uniform grain size and near ideal (103) crystallographic orientation and a method of making. Uniform grain size from 10 .mu.m-500 .mu.m is achieved by using a fine grain five inch diameter titanium billet produced by hot working an electron beam cast billet. Greater than 80% (103) crystallographic orientation is achieved while maintaining uniform and optimal grain size in the target. The result is a higher collimated deposition rate with increased efficiency of bottom coverage of vias and a highly (002) oriented titanium film.

High purity titanium sputtering target and method of making

A high performance, high density sputtering target and a method of making. An aluminum and non-aluminum reactive metal powder blend is subjected to cold pressing under pressure, machining, evacuating, and hot pressing under pressure. The aluminum and non-aluminum metal react directly to yield a high performance, high density sputter target containing greater than about 2% aluminum with substantially uniform composition across the body.

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Edgewater, NJ, United States of America

Suresh Annavarapu