Anelva Corporation

Supika Mashiro

Tomoaki Osada

Kiyotaka Sakamoto

An apparatus for controlling the voltage applied to an electrostatic clamp enables a substrate removing method capable of rapidly, securely and safely removing a substrate regardless of the presence of a dielectric material on the back surface of the substrate to be processed. Before the substrate supported on an electrode by electrostatic clamping is removed, the potential difference between the substrate and the electrode is made zero, and plasma generation is then stopped. The apparatus for controlling the applied voltage has a circuit for detecting the maximum high-frequency voltage (Vpp) for generating a plasma, an operation circuit for computing the self-bias voltage (Vdc) from the maximum high-frequency voltage (Vpp), and an output control circuit for controlling the DC voltage output from a DC power source based on the self-bias voltage (Vdc).

Method of removing substrate and apparatus for controlling applied

A method for rapidly, reliably, and safely removing a substrate from an electrostatic clamping electrode and a mechanism for effecting the method. The method comprises forming a gap between an electrode and a substrate which had been made to hold onto the electrode by electrostatic clamping to increase the electrostatic potential between the substrate and the electrode, generating a DC-glow-discharge in the vicinity of the substrate according to Paschen's law, and removing the substrate from the electrode after eliminating the static charge from the substrate using gas molecules charged by the DC-glow-discharge. A mechanism for effecting the method comprises a means for introducing a gas, a protruding means, a means for controlling the pressure, a sequencer for sequentially activating them, and a lifting mechanism for adjusting the height of the protruding means to the gap distance necessary for generating a DC-glow-discharge between the substrate and the electrode.

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Tokorozawa, Japan

Supika Mashiro