Samsung Electronics Co., Ltd.

Sunpyo Hong

Boseok Moon

Dongwoo Park

Joonmo Ahn

Rakjoon Chung

A manipulator is provided. The manipulator includes a gripper, a depth sensor, a force sensor configured to sense an external force acting on the gripper; a memory storing instructions; and a processor configured to execute the instructions to: control the gripper to grasp an object, acquire first information on the object based on a first sensing value obtained by the force sensor while grasping the object, control the gripper such that a first area of the object comes into contact with a surface on which the object is to be placed, acquire location information on a contact area between the first area and the surface, acquire a rotation direction to rotate the object based on the location information and the first information on the object, control the gripper to rotate the object in the rotation direction around the contact area, and based on a second area of the object being in contact with the surface, control the gripper to release the object.

Growing community of inventors

Suwon-si, South Korea

Sunpyo Hong