Sri International

Averatek Corporation

Csl Limited

Sunity Kumar Sharma

Jaspreet Singh Dhau

Subhash C Narang

Michael Riley Vinson

Shinichi Iketani

Susanna C Ventura

Mihir Reddy

Kuldip Bhasin

Ronald E Pelrine

Roy D Kornbluh

Harsha Prahlad

Scott E Stanford

Asutosh Nigam

Bryan Chavez

Annjoe Wong-Foy

John Stephens Stotts

Naishadh K Saraiya

Donald E Czyzyk

Calvin Chen

Divyakant P Kadiwala

Alex Newsom Beavers, Jr

Madan Lal Sharma

Thomas Furst

Francesco Fornasiero

Durga Annavajjula

Gary Lawrence Borges

Ravi Shankar

Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

Catalyzed metal foil and uses thereof to produce electrical circuits

Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.

Printable surface treatment for aluminum bonding

Methods, systems, and apparatus for coating the internal surface of nano-scale cavities on a substrate are contemplated. A first fluid of high wettability is applied to the nano-scale cavity, filling the cavity. A second fluid carrying a conductor or a catalyst is applied over the opening of the nano-scale cavity. The second fluid has a lower vapor pressure than the first fluid. The first fluid is converted to a gas, for example by heating the substrate. The gas exits the nano-scale cavity, creating a negative pressure or vacuum in the nano-scale cavity. The negative pressure draws the second fluid into the nano-scale cavity. The conductor is deposited on the interior surface of the nano-scale cavity, preferably less than 10 nm thick.

Coating of nano-scaled cavities

Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

Patterning of electroless metals by selective deactivation of catalysts

The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Flexible circuit formation

Thin indium-less 'optically porous' layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.

Indium-less transparent metalized layers

A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

Conductive pattern formation

A coated metal surface is disclosed, with a chemically-bonded film of long-chain organic groups. Such coating may be hydrophobic, and therefore repel the presence of water. This allows the surface to resist corrosion and surface oxidation, without diminishing the desired metallic characteristics of the surface. Further disclosed are methods for applying and coating on various substrates. Such coating may be advantageously applied to protect metals from corrosive environments such as air, water, chemicals, and bodily fluids.

Molecular coating on metal surfaces

Flexible circuits

Flexible circuit chemistry

A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.

Reduced porosity copper deposition

Described herein are several solutions that increase transducer lifetime by reducing or preventing tear propagation in a compliant electroactive polymer. One solution couples a compliant tear resistant treatment to a transducer proximate to an edge portion of the electroactive polymer. Another solution uses a tear resistant layer that couples to and covers a large surface area of the transducer. Another suitable tear resistant solution provides added material outside an active area; the added material reduces stress or strain variations in polymer material outside the active area when the electroactive polymer transducer is deflected or pre-strained.

Tear resistant electroactive polymer transducers

Growing community of inventors

Fremont, CA, United States of America

Sunity Kumar Sharma