Samsung Electronics Co., Ltd.

Sunhong Park

Hyunjong Oh

Doyoung Jung

Jaechan Lee

A printed circuit board, in which two or more copper clad laminates (CCLs) are laminated vertically from an uppermost circuit layer to a lowermost circuit layer, includes a non-destructive testing area, mislamination identifying portions in the non-destructive testing area, the mislamination identifying portions being in the CCLs, respectively, through-via holes vertically exposing the mislamination identifying portions, respectively, in the non-destructive testing area, the through-via holes being spaced apart from each other by a first interval, and a probe via extending vertically and being in contact with an end portion of each of the mislamination identifying portions on a same side. A length of the mislamination identifying portion in an N-th (N is an integer of 1 to K) layer CCL in a horizontal direction is longer than a length of the mislamination identifying positioned in an (N−1)-th layer CCL in the horizontal direction.

Printed circuit board and storage device including the same

A screw anti-loosening structure is provided including a screw disposed within a screw hole. The screw hole is disposed within a first casing. A screw groove is disposed within a second casing. At least one stub protrudes toward the screw hole of the first casing. The screw anti-loosening structure further includes at least one stub groove disposed within a side surface of a head of the screw. The at least one stub is disposed within the stub groove.

Growing community of inventors

Sejong-si, South Korea

Sunhong Park