Samsung Electronics Co., Ltd.

Hyundai Motor Company

Sungwoo Hitech Co., Ltd.

Ms Autotech Co., Ltd.

Shin Young Co., Ltd.

Kia Motors Corporation

Kia Motor Company

Sungyong Park

Mun Yong Lee

Dae Seung Kim

Chang Wook Park

Sang Hoon Chae

Ansook Sul

Dae Keun Kim

Jang-Su Kim

Sang-Lae Lee

Youngjin Kim

Jinyong Park

Seok Heo

Hyunyong Choi

Junsik Choi

Kyoungmin Kim

Jina Kwon

Dongwook Han

Yongwoo Shin

Eunjoo Cho

Jungyon Cho

Log Won Do

Daesik Yoon

Wonguk Seo

Jungrae Kim

Hayeon Kil

Daeho Yang

Siyoung Park

Kiseok Lee

Sejin Park

Yinghu Xu

Songyun Kang

Kiju Sohn

Hongju Kim

Dae-Ho Yang

Heui Won Yang

Hyojin Park

Donok Choi

Bumjin Jang

Seunghwa Kang

Youngho Hwang

Eunseok Seo

Hyeongseok Jo

A wafer cleaning apparatus includes a base, a roller installation table installed on the base, a wafer support unit disposed at the roller installation table and having a support roller for rotatably supporting an edge of a wafer, a pressing roller installed on the roller installation table and above the wafer support unit, and configured to press opposite surfaces of the wafer, and a driving unit providing a force in a direction, crossing a direction of a central axis of the pressing roller, so that a shape of the pressing roller is deformed. The pressing roller deformed by the driving unit applies a first pressure to a central portion of the wafer and a second pressure, different from the first pressure, to an edge portion of the water.

Apparatus for cleaning wafer

A baking apparatus, may include a processing chamber including a lower chamber and an upper chamber connected by a ring shutter; a baking plate in the processing chamber adjacent to a region in which the lower chamber and the ring shutter overlap; an active flow controller including a first module and a second module in the lower chamber adjacent to the baking plate; a first auxiliary flow controller on a lower part of the ring shutter, adjacent to the lower chamber; and a second auxiliary flow controller in the upper chamber adjacent to the ring shutter. The active controller may be configured to move based on movement of the first module in a first direction perpendicular to an upper surface of the baking plate. The active flow controller may be configured to control airflow around the second module by movement of the second module.

Baking apparatus

A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

Substrate drying device and method of drying substrate using the same preliminary class

A chemical solution vaporization device includes a chemical solution tank including chemical solution vaporization rooms, a chemical solution sensing room, and a chemical solution supply room. A first internal wall separating the plurality of chemical solution vaporization rooms from each other includes a first opening at a lower portion thereof. A second internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution supply room includes a second opening at a lower portion thereof. A third internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution sensing room includes a third opening at a lower portion thereof. And a lower portion of a fourth internal wall separating the chemical solution sensing room from the chemical solution supply room is combined with the lower wall.

Chemical solution evaporation device and substrate processing device including the same

A display device and a method capable of rotating a display based on a type of a user command are provided. The display device according to the disclosure receives a user command while first content is displayed on the display, the display being configured to operate in a first orientation while displaying the first content, maintains the display to operate in the first orientation when the received user command is a command to control a feature corresponding to the first content, determines, based on a type of a second content, to control the display to operate in the first orientation or a second orientation different from the first orientation when the received user command is a command to display the second content on the display, and controls the motor to rotate the display based on the determined first orientation or the second orientation.

Display device and controlling method of display device

A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

Wafer processing apparatus and wafer processing method using the same apparatus

A method of assembling a sub-frame of a vehicle with the front side member of the vehicle includes integrally forming a supporting end of a mounting nut that protrudes in a radial direction in a center of an external circumference of the mounting nut, forming a through hole in a lower surface of the front side member, forming a seat as a groove in an internal surface of the through hole, inserting a lower end of the mounting nut into the through hole so that the supporting end is supported by a circumference of the through hole, settling a head of the mounting nut in the seat, and welding the supporting end and the head along the circumference of the through hole and a side of the seat to assemble the sub-frame to the front side member.

Method of assembling sub-frame and front side end in vehicle

A roof side rail is connected to a roof panel and includes a multi-sectional rail having a plurality of integrally formed ribs and bent along a shape of an upper portion of a side surface of a vehicle body, and a reinforcement rail that is combined with an inner side surface of the rail, an upper side flange is connected to the roof panel, and a lower side flange is engaged with a weather strip.

Roof side rail

A mounting unit for a sub-frame of a vehicle is provided. The mounting unit is used for engaging a front side member with the vehicle's sub-frame. The mounting unit includes a welding seat that is formed as a groove on a lower side of the front side member. The mounting unit further includes a mounting nut assembled with the front side member, a welding flange integrated with an external circumference and a head of the mounting nut and inserted into the welding seat to be combined with the welding seat, and a member seat that is formed outside the welding flange and with which a fender upper connecting member is combined.

Mounting unit for sub-frame in vehicle

Growing community of inventors

Suwon-si, South Korea

Sungyong Park