Samsung Electro-mechanics Co., Ltd.

Sungyong An

Chin Mo Kim

Juhyoung Park

Daeki Lim

Jae Yeong Kim

Jeongki Ryoo

Youngsik Hur

Woncheol Lee

Wongi Kim

Nam Ki Kim

Won Cheol Lee

Hyungjin Lee

Jaemin Keum

Dongok Ko

Jungil Kim

Jeongwook Kim

Hyunjun Choi

Sungbum Sohn

Jinwoo Hahn

Soonmo Song

An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.

Antenna device

An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.

An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

Antenna

A dielectric resonator antenna includes a first dielectric material block, a second dielectric material block stacked in a first direction on the first dielectric material block, a bonding layer disposed between the first dielectric material block and the second dielectric material block, and combined to the first dielectric material block and the second dielectric material block, a feeder disposed on the first dielectric material block, a feed pattern disposed between the first dielectric material block and the second dielectric material block and connected to the feeder, and an antenna patch disposed between the first dielectric material block and the second dielectric material block and spaced from the feed pattern.

Dielectric resonator antenna and antenna module

A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

Chip antenna and manufacturing method thereof

An antenna apparatus includes: a first dielectric layer having a first dielectric constant; a first patch antenna pattern disposed in the first dielectric layer; a second dielectric layer having a second dielectric constant; a second patch antenna pattern disposed on the second dielectric layer; a first feed via coupled to the first patch antenna pattern; and a second feed via coupled to the second patch antenna pattern. The first dielectric constant is higher than the second dielectric constant, and a frequency of a signal transmitted/received by the first patch antenna pattern is lower than a frequency of a signal transmitted/received by the second patch antenna pattern.

Antenna apparatus

An antenna device is provided. The antenna device includes an antenna body portion configured to transmit and/or receive a radio frequency (RF) signal, and including a dielectric material having a first dielectric constant; a metal layer configured to contact the antenna body portion; a first insulation layer configured to cover at least a part of the metal layer; and an electrical connection structure configured to be electrically connected to the metal layer, wherein the first dielectric constant of the antenna body portion is larger than a dielectric constant of the first insulation layer, and is smaller than a dielectric constant of the metal layer.

A chip antenna includes: a dielectric material block including a plurality of sides including a first side, a second side, and a third side that are different from each other; a first antenna portion including a first conductor pattern disposed on the first side; a second antenna portion including a second conductor pattern disposed on the second side; and a third antenna portion including a third conductor pattern disposed on the third side. The first conductor pattern, the second conductor pattern, and the third conductor pattern are respectively isolated on the first side, the second side, and the third side, and are independently positioned.

Chip antenna

An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.

Provided are a glass powder represented as aLiO-bKO-cBaO-dBO-eSiOwherein a+b+c+d+e=1, and 0.01&#x2266;a&#x2266;0.1, 0.01&#x2266;b&#x2266;0.1, 0.01&#x2266;c&#x2266;0.1, 0.05&#x2266;d&#x2266;0.3, and 0.3&#x2266;e&#x2266;0.7 are satisfied in terms of mol %, a method of manufacturing the same, and a multi-layered ceramic material using the same. Therefore, a nano glass powder having an average particle size of 100nm or less and uniform particle size distribution can be manufactured using liquid phase deposition, specifically, a sol-gel method. In addition, the glass powder can be used as sintering additives to decrease a sintering temperature by about 100&#xb0; C. in comparison with conventional glass upon manufacture of a ceramic material such as MLCC and MLCI, which can be sintered at a low temperature, contributing to improvement of dielectric capacity and inductance capacity of the parts and increasing quality coefficient.

Growing community of inventors

Suwon-si, South Korea

Sungyong An