Samsung Electronics Co., Ltd.

Sungwoo Lim

Jiwoo Lee

Youngwook Kim

Jonggeun Yoon

Chankyu Lim

An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.

Growing community of inventors

Suwon-si, South Korea

Sungwoo Lim