Samsung Electronics Co., Ltd.

Institute for Basic Science

Sungkyu Park

Beomkyu Shin

Dongwook Kim

Jongbo Shim

Kui-Yon Mun

Hyunki Kim

Yongkwan Lee

Choongbin Yim

Jihwang Kim

Changhoon Kim

Donghyoun Son

Byoungwook Jang

Se Jeong Na

Sungwon Park

Sundong Kim

Inseok Shim

Meeyoung Cha

Sungwon Han

Disclosed is an image analysis system which includes a first analyzer and a second analyzer. The first analyzer generates first features by encoding images through a first model and adjusts a weight of the first model based on the first features. The second analyzer generates second features based on the first features by encoding the images through a second model, classifies the second features into classes, respectively, and adjusts a weight of the second model based on mutual information and a correlation between a first class among the classes which features corresponding to an original image group from among the second features are classified as and a second class among the classes which features corresponding to an augmentation group of the original image group from among the second features are classified as.

Image analysis system and operating method of the same

A nonvolatile memory device performs a compare and write operation. The compare and write operation includes reading read data from memory cells, inverting first write data to generate second write data, adding a first flag bit to the first write data to generate third write data and adding a second flag bit to the second write data to generate fourth write data, performing a reinforcement operation on each of the third write data and the fourth write data to generate fifth write data and sixth write data, and comparing the read data with each of the fifth write data and the sixth write data and writing one of the fifth and sixth write data in the memory cells based on a result of the comparison.

Nonvolatile memory device and memory system including nonvolatile memory device

A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.

Interposer and semiconductor package including the same

A memory system includes a memory device including memory cells, and a controller that performs a write operation, a read operation, and a check operation on the memory device. During the check operation, the controller controls the memory device to read check data from target memory cells of the memory cells by using a check level, compares the check data with original data stored in the target memory cells, and determines a reliability of the target memory cells or the check data based on a result of the comparison.

Memory system and operating method of memory system

An electronic device comprising: a microphone; a communication circuit; a memory; and at least one processor operatively coupled to the memory, configured to: acquire voice data by using the microphone; identify a user corresponding to the voice data; select an external device based at least in part on an identity of the user; and transmit a connection request to the external device by using the communication circuit.

Method of performing communication and electronic device supporting same

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Seoul, South Korea

Sungkyu Park