Lg Electronics Inc.

Stats Chippac Pte. Ltd.

SungHyun Lee

JoungIn Yang

Jongin Im

YoungSik Cho

A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit with an adhesive attached thereto; connecting the integrated circuit and a plated interconnect pad; attaching an embedded interconnect to the plated interconnect pad; and forming an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side and the plated interconnect pad and the adhesive exposed from the encapsulation second side.

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

A watch type mobile terminal includes: a main body having a wireless communication module; a band connected with both ends of the main body; a buckle unit mounted to the band and detachably attaching the band to the user's wrist through a connection and releasing operation; and a signal generating unit mounted in the buckle unit, electrically connected with the main body and generating a signal for turning on power of the main body when the buckle unit is connected.

Growing community of inventors

Seoul, South Korea

SungHyun Lee