Samsung Electronics Co., Ltd.

Avicenatech Corp.

Sunghwan Min

Bardia Pezeshki

Robert Kalman

Young Koog

Jiankang Wang

Harpreet Gill

A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.

Packaging microLED optical interconnects

An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.

Integrated circuits with internal pads

Growing community of inventors

Sunnyvale, CA, United States of America

Sunghwan Min