Samsung Electronics Co., Ltd.

Amkor Technology, Inc.

SungGeun Kang

Do Hyung Kim

Jong Sik Paek

Won Chul Do

Doo Hyun Park

Junghoon Park

Seungbo Shim

Seong Min Seo

Yong Min Song

In Bae Park

Heejin Lee

Junhee Han

Pil Je Sung

Jin Hee Park

Yongjin Woo

Younggirl Yun

Chang Min Lee

Waneui Jung

Jaeyeon Ra

Juho Yi

Myungsub Ko

An electronic device is provided, which includes a printed circuit board (PCB) including a first surface and a second surface facing in a direction opposite to the first surface; and an interface terminal positioned at least partially on the first surface of the PCB, The interface terminal includes a shell including a hollow portion extending from a first opening on a first side of the shell to a second opening on a second side of the shell, a terminal structure including a non-conductive plate positioned in the hollow portion and a plurality of terminals positioned on the non-conductive plate, a first bracket that at least partially covers a surface of the shell, and a second bracket that at least partially covers another surface of the shell. The second bracket includes a protrusion protruding with respect to the second surface of the PCB.

Electronic device including interface terminal having outer shell and bracket

An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

Electronic device using interposer in printed circuit board

A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.

Semiconductor device utilzing redistribution layers to couple stacked die

Growing community of inventors

Gyeonggi-do, South Korea

SungGeun Kang