Samsung Electronics Co., Ltd.

Sungbok Hong

Youngsik Kim

Doojin Kim

Kitaik Oh

Yongmin Kim

Hyungjin Lee

Chulmin Kim

A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.

Semiconductor packages and methods of manufacturing the same

A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Magazine for loading a lead frame

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Chungcheongnam-do, South Korea

Sungbok Hong