Samsung Electronics Co., Ltd.

Ls Cable Ltd.

Sung-Wook Jung

Kwang-Nam Kim

Jong-Woo Sun

Jung-Pyo Hong

Jeongryul Kim

Sung-ho Kang

Sang-Rok Oh

Hae-Joong Park

Nam-Young Cho

Byeong-Hee Kim

Sung-Jin Kim

Jin-Young Kim

Youngseok Kim

Daeyoung Moon

Sun-Ho Kim

Seongkeun Cho

Yong-Suk Kim

Young-Ju Kang

Cheol-Kyu Yang

Seog-Min Lee

Jae-Chul Hwang

Young Sin Kim

Sung-Chul Shin

Gyu-Chan Jeoung

Keum Joo Lee

Suhwan Hwang

Jae Seong Park

Kyu-Chul Shim

Jong-Geug Kim

Ji-Hoon Yeo

Jin-Uk Park

Shin-Sang Lee

Byeong-geun Jang

In-Pil Cha

Sungduk Hong

A semiconductor memory device includes a substrate including a cell area and a peripheral area defined by a periphery of the cell area, the cell area including a dummy cell area and a normal cell area, and an active area defined by a cell element isolation film. The device includes a cell area separation film defining the cell area in the substrate, the dummy cell area defining a boundary with the cell area separation film between the normal cell area and the cell area separation film. The device includes a normal bit-line on the normal cell area and extending in a first direction, a dummy bit-line group on the dummy cell area, the dummy bit-line group including a plurality of dummy bit-lines extending in the first direction, and a plurality of storage contacts connected to the active area and located along a second direction perpendicular to the first direction.

Semiconductor memory device and method for manufacturing the same

A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Loadlock module and semiconductor manufacturing apparatus including the same

An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.

Apparatus and method of attaching pad on edge ring

The mold clamping unit comprises a column mounted in a transfer means and moving in forward and backward direction; a mold clamping piston in which clamping operation and clamping-releasing operation are performed; plurality of column teeth disposed on a surface of the column along an axial direction of the column; center bore provided in a central of the mold clamping piston; clamping tooth seating groove with a plurality of clamping teeth inside the mold clamping piston contacting the center bore; rotating plate with plurality of clamping tooth guide grooves separated from the clamping teeth in the axial direction of the column; and a teeth rod positioned in each of the clamping tooth guide groove, wherein each teeth rod is connected to each clamping teeth during the rotation of the rotating plate, for moving each clamping tooth in a central or radial direction of the rotating plate and clamping of the clamping tooth and the column can proceed.

Mold clamping unit

A mass flow controller includes a base having a first passage, an inlet portion for introducing fluid into the first passage, an outlet portion for releasing the fluid from the first passage, and a second passage branched from a first upstream portion of the first passage and connected to a second downstream portion of the first passage A mass flow sensor is connected to the first passage between the inlet portion of the base and the first portion of the first passage; A first valve is disposed in-line with the first passage between the first and second portions. The first valve controls the mass flow of the fluid passing through the first passage;. A second valve is disposed in-line with the second passage to opens/close the second passage. A valve controller compares the mass flow measured by the mass flow sensor to a standard flow, and then positions the first valve such that the measured mass flow corresponds to the standard flow.

Substrate processing equipment having mass flow controller

A mass flow controller includes a base having a passage that allows a fluid to pass through the passage. A first control valve controls a mass flow of a fluid passing through the passage. A second control valve controls a full scale of the mass flow of the fluid. A bypass portion is disposed in the passage through which the fluid passes. A mass flow sensor measures the mass flow of the fluid passing through the bypass portion. The second control valve is connected to the passage adjacent to the bypass portion for controlling the full scale of the mass flow of the fluid passing through the bypass portion.

Mass flow controller

Growing community of inventors

Seoul, South Korea

Sung-Wook Jung