Other

Samsung Electro-mechanics Co., Ltd.

Sung Wook Chun

Dek Gin Yang

Yang Je Lee

Won Hyung Park

Min Eui Hong

Kyung Jin Heo

Byong Ho Lee

Myong Gun Chong

Kyu Hong An

Jin Su Yeo

Jae Ok Lim

Chul Min Lee

Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Substrate structure and method of manufacturing the same

Disclosed are a conversion coating composition for use in the surface treatment of a PCB and a conversion coating method using the same. The composition comprises 0.1-30 vol % of sulfuric acid; 0.1-15 vol % of hydrogen peroxide; 0.01-10 wt % of an organic acid; 0.1-30 wt % of a nitrogen compound; 0.01-10 wt % of an organic silicate and/or organic titanate; and 0.1-20 wt % of a film forming auxiliary, 0.1-30 wt % of an etching rate controller, 0.1-20 wt % of a reaction promoter and/or 0.1-20 g/l of a stabilizer. This composition is applied to a PCB at 10-60&deg; C. for 1-10 min. The conversion coating film is superb in adhesive strength, acid resistance, and adhesion and can be formed with ease.

Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same

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Incheon-si, South Korea

Sung Wook Chun