Apple Inc.

Sung Woo Yoo

Connor Raymond Duke

Kieran Poulain

Michael Eng

Eric Steven Jol

Brian S Tryon

Shaohai Chen

Derek J Walters

Paul Aurelio Martinez

Jeffrey M Thoma

Benjamin A Bard

Curtis C Mead

Paul L Nangeroni

Zhong-Qing Gong

James W Bilanski

Nicholas Kunst

Gemin Li

Mingzhe Li

Amanda R Rainer

Kevin R Richardson

Miguel Alejandro Lara-Pena

Nelson J Kottke

Weng Choy Foo

Shaoqing Xiang

Chun Cheng Teo

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Printed circuit board assembly having a damping layer

An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures

A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

Electronic device with electromagnetic shielding structures

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Santa Clara, CA, United States of America

Sung Woo Yoo