Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Hynix Semiconductor Inc.

Skhynix Inc.

Solum Co., Ltd.

Other

Kt Corporation

Sung Woo Han

Ic Su Oh

Yong Ju Kim

Chang Kun Park

Tae Jin Hwang

Hyung Soo Kim

Hae Rang Choi

Jae Min Jang

Ji Wang Lee

Hee Woong Song

Tae Kyung Lee

Hwa Sun Lee

Ran Hee Shin

Sung Sun Kim

Jong Woo Kim

Young Min Lee

Heung Gyoon Choi

Tae Won Heo

Jae Gen Eom

Young Seung Noh

Seh Hoon Jang

Nak Jun Jeong

Yoon Su Kim

Seong Hwi Song

Minsung Kim

Won Jae Han

In Young Kang

Seung Joo Shin

Geun Chui Park

Tae Yong Lee

Jae Hoon Choi

Moon Chul Lee

Doo Hwan Lee

Young Do Kweon

Yun Sung Kang

Jin Suk Son

Tae Hun Lee

Geun Young Park

Jeong Suong Yang

Byung Ho Kim

Sun Ki Cho

Jeonghoon Kang

Eun Tae Park

Joo Young Choi

Jun Ho Lee

Jae Sang Lee

Boo Ho Jung

Yang Hee Kim

Seung Min Baek

Kwanwoo Hong

Sunghoon Kim

Tae Yoon Kim

Min-Sung Kim

Dongwoo Shin

Jong Woon Kim

Chang Hyun Lim

Jeong Hoon Kang

Byung Lyul Park

Qwan Ho Chung

Jin Gu Kim

Jae Chang Lee

Jae Eun Kim

Kyung Seob Oh

Sung Min Cho

Hyung Jin Jeon

Johannes Büsing

Yoon Sok Park

Sangik Cho

Hyo A Kang

Seung Wan Yoo

Kyoung Moo Harr

Pil Jin Yoo

Ji Sun Yang

Sang Joon Lim

Hyunjoo Kim

Young Hun Kim

Dae Ho Kim

Nokhaeng Lee

In Chul Song

Seok Il Hong

Jinbaek Kim

Hooijoong Kim

Bo Kyung Jung

Jeawon Lee

Jeong-hoon Kang

Seon Ju Yeo

Geonung Lee

Young Jae Lee

Eul Chul Jang

Hwangmook Cho

Kang Tae Lee

Gyu-Sung Na

Gyu-sung Na

Seong In Yune

Joon Won Ko

Kipyo Hong

Mi-Geum Kim

Hoseung Jang

Kyung Suk Shim

Du Sung Jung

A multilayer ceramic capacitor may include a ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes disposed inside the ceramic body, a first external electrode disposed outside the ceramic body and connected to the plurality of first internal electrodes, and a second external electrode disposed outside the ceramic body and connected to the plurality of second internal electrodes, where the first external electrode may include, a first conductive carbon layer electrically connected to the plurality of first internal electrodes, and a first plated layer covering the first conductive carbon layer, and where the second external electrode may include, a second conductive carbon layer electrically connected to the plurality of second internal electrodes, and a second plated layer covering the second conductive carbon layer.

Multilayered ceramic capacitor

Disclosed herein is a range hood having improved sound characteristics by improving a structure thereof. The range hood includes a case including an inlet through which air is introduced, and a fan module arranged inside the case to suck air through the inlet. The fan module includes a fan configured to move air by rotating, a motor configured to supply a driving force to rotate the fan, a fan frame provided to accommodate the fan and the motor therein, the fan frame including a fan inlet and a fan outlet, and a sound generating member provided to generate a sound of a predetermined frequency band when in contact with the air discharged through the fan outlet.

Range hood

A method of manufacturing a motor assembly comprising a motor and an impeller coupled to a rotation shaft of the motor, the method includes disposing a plurality of balls in a ring-shaped groove formed in a surface of the impeller; rotating the impeller at a speed greater than a resonant rotation speed to move the balls to a compensation position for compensating for an eccentricity in the motor assembly; and fixing the balls at the compensation position in the groove.

Motor assembly and method of manufacturing the same

An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Acoustic resonator and method of manufacturing the same

A clothes care apparatus including: a main body including a clothes care room; a blower configured to form an airflow inside the clothes care room formed therein, and disposed between an upper part of the clothes care room and an upper part of the main body; and a duct configured to allow air inside the clothes care room to be introduced into the blower by the blower, and formed between a rear part of the main body and a rear part of the clothes care room, wherein the blower includes a blowing fan and a scroll to cover the blowing fan, and the scroll includes a flat portion formed to extend in a direction corresponding to an extension direction of the duct to guide the air into the blower.

Clothes care apparatus

An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).

Acoustic resonator filter

A dishwasher includes a tub forming a washing chamber and a blowing unit that blows air into the tub, where the blowing unit includes a housing having a discharge port, a blowing fan disposed inside the housing, and a valve disposed between the blowing fan and the discharge port to prevent moisture from being introduced into the blowing fan, and the valve is rotated from a closed position to an open position by blowing of the blowing fan and return to the closed position again by an own weight thereof.

Dishwasher having an improved structure to improve drying performance

A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.

Semiconductor package

A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Disclosed herein is a washing apparatus includes a drum, a pulsator, a drum drive motor rotates the drum in a first direction or a second direction, a pulsator drive motor rotates the pulsator in the first direction or the second direction, and a controller controls the drum drive motor to rotate the drum in the first direction and to rotate the drum in the second direction when an operation period expires. When a drum drive current value is greater than a first reference current value during the first direction rotation of the drum, the controller controls the drum drive motor so that the drum drive motor stops rotating the drum in the first direction. When the operation period expires the controller controls the drum drive motor so that the drum is rotated in the second direction.

Washing apparatus and controlling method thereof

A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.

A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.

Transformer and power supply device including the same

A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.

Bulk acoustic wave resonator and filter including the same

A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

Bulk acoustic wave resonator device

An acoustic resonator including a substrate, an active vibration region including, sequentially stacked on the substrate, a lower electrode, a piezoelectric layer, and an upper electrode, and a horizontal resonance suppressing part formed from and disposed in the piezoelectric layer, the horizontal resonance suppressing part having piezoelectric physical properties that are different from piezoelectric physical properties of the piezoelectric layer.

Acoustic resonator and method

Growing community of inventors

Ichon-si, South Korea

Sung Woo Han