Hyundai Motor Company

Kia Corporation

Kia Motors Corporation

Ods Co., Ltd.

Gbrain Inc.

Sung Won Park

Hyeon Uk Kim

Sang Won Lee

Jun Hee Park

Hyun Koo Lee

Jin Myeong Yang

Jong Hyun Ahn

Dong Chil Kwon

Hyun Chul Kim

Woo Yong Jeon

Young Cheol Chae

Jeong Min Son

Han Jin Do

Sung Gu Yang

Je Jung Kim

A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.

Power module

Provided are a composition for forming a transparent orthodontic device, a method of preparing a transparent orthodontic device, and a transparent orthodontic device prepared by using the method. The composition includes 100 parts by weight of a first photocurable compound represented by Formula 1, 35 parts by weight to 75 parts by weight of a second photocurable compound represented by Formula 2, 15 parts by weight to 65 parts by weight of a third photocurable compound represented by Formula 3, 5 parts by weight to 40 parts by weight of a fourth photocurable compound represented by Formula 4, and 1 part by weight to 15 parts by weight of a fifth photocurable compound represented by Formula 5.

Composition for forming transparent orthodontic device, method of preparing transparent orthodontic device, and transparent orthodontic device prepared by using the method

An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.

Insulating substrate and power module using the same

A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Power module and method of manufacturing the same

An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal diffusion inductor of a plurality of inner thermal diffusion inductors is inserted into the inner metal layer.

Insulating substrate and dual-side cooled power module using the same

A power module includes a substrate having a dielectric layer, a first power semiconductor device disposed on an upper part of the substrate, and a second power semiconductor device disposed on a lower part of the substrate.

Power module and method of manufacturing same

Shoe stud

Shoe studs support

A signal block and a double-faced cooling power module that uses the signal block is provided. The signal block includes a plurality of signal clips that are formed in a ribbon shape to connect a first signal pad formed on a semiconductor chip and a second signal pad formed on a signal lead frame. An insulator fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.

Signal block and double-faced cooling power module using the same

Growing community of inventors

Incheon, South Korea

Sung Won Park