Intel Corporation

Sung-Won Moon

Mathew J Manusharow

Edvin Cetegen

Ajit V Sathe

Bogdan M Simion

Todd Michael Young

Mingjie Xu

Suzana Prsitic

Gopi Krishnan

Curtis S White

An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.

Controlling thermal interface material bleed out

The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages with an underfill material dispenser. In at least one embodiment, an underfill material dispenser may include a heater having a plurality of conduits. Other embodiments of the present disclosure may further include multiple dispense needle configurations, angled dispense nozzle exit conduits, conical nozzle exit conduits, and satellite traps.

Underfill material dispenser

The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Passive thermal solution for hand-held devices

Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit ('IC') dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Growing community of inventors

Phoenix, AZ, United States of America

Sung-Won Moon