Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Sung Taek Woo

Dong Jin Kim

Ha Yong Jung

Ji Hye Shim

Jae Min Choi

Jae Kul Lee

Woon Chui Choi

Han Sang Cho

Han Kook Cho

Woon Ha Choi

Equipment for strengthening swing motion ability of the present disclosure includes: a shoulder holder formed in a closed loop shape to be held on a right shoulder or a left shoulder; a body holder extending a predetermined length from the shoulder holder to be held on a back toward a shoulder opposite to the shoulder with the shoulder holder held thereon; a pelvis holder extending a predetermined length from the body holder to be held on a pelvis positioned opposite to the shoulder with the shoulder holder held thereon; an extension extending a predetermined length from the pelvis holder toward the shoulder with the shoulder holder held thereon; and an elasticity applier having a first end connected to the extension and a second end configured to be fixed to a predetermined position.

Equipment for strengthening swing motion ability

A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Fan-out sensor package

A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Growing community of inventors

Suwon-si, South Korea

Sung Taek Woo