Lumens Co., Ltd.

Sung Sik Jo

Seung Hyun Oh

In Soo Kim

Jung Hyun Park

Tae Kyung Yoo

Jung A Lim

Pyeong Guk Kim

Sung Yole Yun

Seok Lee

Seung Hoon Lee

Pyoung Gug Kim

Ho Joong Lim

Byeong Geon Kim

Jae Yoon Lim

A light-emitting device package includes an LED chip including a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure, a wavelength conversion member having one surface in contact with the upper surface of the substrate, a light transmitting member covering a side surface of the LED chip and one surface of the wavelength conversion member adjacent to the side surface, and a reflector including at least one first region covering a side surface of the wavelength conversion member and the light transmitting member, and at least one second region covering the light transmitting member and exposing the side surface of the wavelength conversion member.

Light-emitting device package for back light and manufacturing method thereof

A light-emitting device package includes a frame including one side on which a first electrode is formed and the other side on which a second electrode is formed, an LED chip including a first conductive connection pad electrically connected to the first electrode and a second conductive connection pad electrically connected to the second electrode, a reflective member disposed on the frame, forming a cavity for accommodating the LED chip therein, and reflecting light emitted from the LED chip, and a wavelength conversion member filled in the cavity to cover the LED chip, wherein the reflective member includes a first side and a second side different from the first side, and a first height of the first side and a second height of the second side are formed to be different from each other.

Light emitting device pakage

Provided is a backlight unit including: a substrate; a plurality of light-emitting devices mounted on the substrate; and an optical sheet disposed above the light-emitting devices, wherein the optical sheet is in contact with a light-emitting surface of at least one light-emitting device via one surface thereof, and emits light of the light-emitting device incident on one surface thereof to the other surface facing the one surface, while refracting or dispersing the light in a direction different from a direction in which the light is incident due to an optical pattern formed therein.

Ultra-slim backlight unit

The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet. An apparatus for manufacturing a light-emitting diode (LED) module according to one embodiment of the present invention, in which the light-emitting diode module comprises a plurality of light-emitting diodes each having one side surface with an exposed electrode surface and the other side surface corresponding to the one side surface, comprises: a sheet placement unit in which a sheet having a lower portion to which the other side surfaces of the plurality of light-emitting diodes are adhered is placed; a substrate placement unit in which a substrate is placed at a position corresponding to the sheet in the lower portion of the sheet, wherein the substrate has thereon a conductive pattern to which the one side surfaces of the plurality of light-emitting diodes are electrically contacted; and a multi-transfer unit having, on a higher portion of the sheet, a plurality of eject pins for transferring the plurality of light-emitting diodes adhered to the lower portion of the sheet onto the substrate, wherein the multi-transfer unit is characterized in that the plurality of eject pins transfer the plurality of light-emitting diodes onto the substrate.

Apparatus and method for manufacturing light-emitting diode module

Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting device and a lower surface of the first wavelength converting layer.

Quantum dot plate assembly and LED package and module comprising the same

Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package

A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Growing community of inventors

Jeollanam-do, South Korea

Sung Sik Jo