Amkor Technology, Inc.

Sung Sik Jang

Young Suk Chung

Won Chul Do

Jae Hun Ku

Byung Hoon Ahn

Suk Gu Ko

Young Nam Choi

Jae Hak Yee

Jung Woo Lee

Choon Heung Lee

Jae Jin Lee

Hyung Ju Lee

Mu Hwan Seo

Tae Heon Lee

Ku Sun Hong

Su Yol Yoo

Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

Leadframe and semiconductor package made using the leadframe

A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.

Semiconductor package having improved adhesiveness and ground bonding

A leadframe comprising a frame body having four peripheral sides, each adjacent pair of which collectively defines a frame corner. Disposed within a central space or opening defined by the frame body is a die paddle including four peripheral edge segments, each adjacent pair of which collectively define a paddle corner. The leadframe also includes a plurality of tie bars, each of which comprises a first portion extending from a respective paddle corner of the die paddle and a second portion which extends angularly from the first portion and perpendicularly into connection with one of the sides of the frame body. Connected to and extending from the sides of the frame body toward and in spaced relation to respective ones of the peripheral edge segments of the die paddle are a plurality of leads. Additionally, connected to and extending from the sides of the frame body in close proximity to respective ones of the frame corners are a plurality of corner leads. Each of the corner leads extends in spaced, generally parallel relation to at least one of the peripheral edge segments of the die paddle.

Leadframe including corner leads and semiconductor package using same

A semiconductor package and the leadframe therefor having a reverse-down set part formed in the tie bar supporting the chip paddle. The reverse-down set part of the tie bar may be formed by a mechanical stamping process in such a way that it is present within the insulating body, interlocking therewith. This feature also facilitates the prevention of a short circuit between the tie bar that is exposed externally from the package body and the exposed internal lead through solder upon the mounting of a semiconductor package onto a motherboard.

Semiconductor package leadframe assembly and method of manufacture

Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H SO )-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.

Semiconductor device having increased moisture path and increased solder joint strength

Growing community of inventors

Hanam-shi, South Korea

Sung Sik Jang