Samsung Electro-Mechanics Co., Ltd.

Sung Min Song

Hwan Soo Lee

Yoon Hee Cho

Jae Hyun Lim

Heung Woo Park

Jun Woo Myung

Kang Hyun Lee

Jung Gon Choi

Gun Woo Koo

Yong Jong Park

Hwi Dae Kim

Bum Sik Jang

A coil component includes a support member, an internal coil supported by the support member and including a plurality of coil patterns, and external electrodes connected to the internal coil and including a first layer in contact with the internal coil and a second layer disposed on the first layer. The second layer is a composite layer including a conductive material and a resin. The support member includes first and second surfaces facing the external electrodes, respectively, and one or more of at least a portion of the first surface and at least a portion of the second surface are configured as cut surfaces.

Coil component

A coil component includes a body, an internal insulating layer disposed in the body, and a coil portion disposed on the internal insulating layer. The coil portion includes first and second coil patterns disposed on opposing surfaces of the internal insulating layer, respectively, first main and first auxiliary lead-out portions extending from the first coil pattern and respectively exposed to a front surface and one side surface of the body connected to each other, and second main and second auxiliary lead-out portions extending from the second coil pattern and respectively exposed to a rear surface and another side surface of the body connected to each other.

An inductor includes a body including a support member including a through-hole, an internal coil disposed on the support member, and an encapsulant encapsulating the support member and the internal coil; and an external electrode disposed on an external surface of the body and connected to the internal coil. The external electrode includes a conductive resin layer and a double conductive layer of a first conductive layer and a second conductive layer, disposed between the conductive resin layer and the internal coil.

Inductor

An inductor includes a body including a substrate, a coil portion, including a top coil and a bottom coil disposed on one surface and the other surface of the substrate, respectively, and an encapsulation portion encapsulating the substrate and the coil portion, a first terminal electrode, disposed on a bottom surface of the body and connected to the top coil, and a second terminal electrode disposed on the bottom surface of the body and connected to the bottom coil, a third terminal electrode disposed between the first and second terminal electrodes and disposed on the bottom surface of the body, and a shielding layer disposed to cover the body. The shielding layer is connected to the third terminal electrode.

An inductor includes first and second external electrodes spaced apart from each other, a substrate disposed between the first and second external electrodes and having a first surface and a second surface opposing each other, and a conductive structure electrically connected to the first and second external electrodes. The conductive structure includes a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, and at least one reinforcing portion. The first conductive pattern has a first side facing the first external electrode, the second conductive pattern has a second side facing the second external electrode, and the at least one reinforcing portion is electrically connected to at least one of the first and second sides and is interposed between the substrate and at least one of the first and second external electrodes.

A coil component includes a body including a coil including lead portions at both ends thereof and a magnetic material sealing the coil and external electrodes disposed on outer surfaces of the body and connected to the lead portions, respectively. An outer surface of the coil including at least one of an upper surface, a lower surface, and a side surface of the coil includes a surface area increasing portion.

A coil component includes: a coil part including a coil conductor; and a body formed adjacently to the coil part and including first and second magnetic powder particles having different average particle sizes, wherein an average particle size of the first magnetic powder particles is smaller than an interval between adjacent patterns of the coil conductor, and an average particle size of the second magnetic powder particles is greater than the interval between the adjacent patterns of the coil conductor.

An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Image sensor assembly, method of manufacturing the same, and camera module

A coil component includes a body having a volume of 2.4 mmor less and including at least one coil member embedded therein, and first and second external electrodes partially or entirely formed on first and second surfaces of the body opposing each other, respectively, wherein the product of inductance Ls (&#x3bc;H) and S/l (mm) is 0.45 (&#x3bc;H&#xb7;mm) or more to 0.75 (&#x3bc;H&#xb7;mm) or less in which S (mm) is an area of regions of the first and second external electrodes disposed on the first and second surfaces of the body, and 1 (mm) is a minimum spaced distance between the first and second external electrodes formed on the first and second surfaces of the body.

A semiconductor package includes a substrate, at least one electronic device, a lead frame, and a molded portion. The substrate has at least one indented portion formed as a groove therein. The electronic device is mounted on one surface of the substrate. The lead frame is bonded to the substrate and electrically connected to the electronic device. The molded portion seals the lead frame and the electronic device and includes at least one through hole extending the indented portion.

Semiconductor package with an indented portion and manufacturing method thereof

The semiconductor package according to an exemplary embodiment in the present disclosure includes: at least one electronic device; a lead frame including a plurality of leads electrically connected to the electronic device; a lead connecting member coupled to at least one of the leads; and a molded portion sealing the electronic device and the lead connecting member.

Semiconductor package including a connecting member

There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a substrate having a first device mounted thereon; a first lead frame formed on the substrate; a second lead frame formed to be spaced apart from the substrate; a post formed on the substrate and formed between the first lead frame and the second lead frame; and a molding part formed to surround the substrate and formed to protrude portions of the first and second lead frames, wherein the post includes a body part bonded to the substrate and a protruding part protruded to an exterior of the molding part.

Semiconductor package and method of manufacturing the same

Disclosed herein are a power module package and a method for manufacturing the same. According to a preferred embodiment of the present invention, a power module package includes: a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area.

Growing community of inventors

Suwon-si, South Korea

Sung Min Song